Inventor
HARTWELL PETER G
US23 patents
⚠️ This page may combine multiple inventors who share the name “HARTWELL PETER G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
13 patentsUS7342575B1Mar 11, 2008
Electronic writing systems and methods
HEWLETT PACKARD DEVELOPMENT CO92 citations98
US6798392B2Sep 28, 2004
Smart helmet
HEWLETT PACKARD DEVELOPMENT CO111 citations98
US6600201B2Jul 29, 2003
Systems with high density packing of micromachines
HEWLETT PACKARD DEVELOPMENT CO224 citations98
US6955976B2Oct 18, 2005
Method for dicing wafer stacks to provide access to interior structures
HEWLETT PACKARD DEVELOPMENT CO19 citations92
US6930368B2Aug 16, 2005
MEMS having a three-wafer structure
HEWLETT PACKARD DEVELOPMENT CO33 citations92
US6784630B2Aug 31, 2004
Use of standoffs to protect atomic resolution storage mover for out-of-plan motion
HEWLETT PACKARD DEVELOPMENT CO15 citations92
US7042105B2May 9, 2006
Methods for dicing wafer stacks to provide access to interior structures
HEWLETT PACKARD DEVELOPMENT CO12 citations84
US6784593B2Aug 31, 2004
Use of standoffs to protect atomic resolution storage mover for out-of-plane motion
HEWLETT PACKARD DEVELOPMENT CO10 citations73
US6784592B2Aug 31, 2004
Use of standoffs to protect atomic resolution storage mover for out-of-plane motion
HEWLETT PACKARD DEVELOPMENT CO11 citations73
US8030754B2Oct 4, 2011
Chip cooling channels formed in wafer bonding gap
HEWLETT PACKARD DEVELOPMENT CO6 citations63
US7618752B2Nov 17, 2009
Deformation-based contact lithography systems, apparatus and methods
HEWLETT PACKARD DEVELOPMENT CO2 citations61
US6953704B2Oct 11, 2005
Systems with high density packing of micromachines
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US7118679B2Oct 10, 2006
Method of fabricating a sharp protrusion
HEWLETT PACKARD DEVELOPMENT CO0 citations42
APPLE INC
3 patentsUS9446941B2Sep 20, 2016
Method of lower profile MEMS package with stress isolations
APPLE INC3 citations73
US9656856B2May 23, 2017
Method of lower profile MEMS package with stress isolations
APPLE INC1 citations52
US9752877B2Sep 5, 2017
Electronic device having electronic compass with demagnetizing coil and annular flux concentrating yokes
APPLE INC0 citations48