Inventor
NISHITA TAKAFUMI
JP27 patents
⚠️ This page may combine multiple inventors who share the name “NISHITA TAKAFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS TECH CORP
12 patentsUS6872597B2Mar 29, 2005
Method of manufacturing a semiconductor device and a semiconductor device
RENESAS TECH CORP13 citations92
US6750080B2Jun 15, 2004
Semiconductor device and process for manufacturing the same
RENESAS TECH CORP24 citations92
US6723583B2Apr 20, 2004
Method of manufacturing a semiconductor device using a mold
RENESAS TECH CORP25 citations92
US7396701B2Jul 8, 2008
Electronic device and manufacturing method of the same
RENESAS TECH CORP24 citations89
US7332800B2Feb 19, 2008
Semiconductor device
RENESAS TECH CORP15 citations83
US7449786B2Nov 11, 2008
Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors
RENESAS TECH CORP6 citations73
US7049214B2May 23, 2006
Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors
RENESAS TECH CORP8 citations73
US6692989B2Feb 17, 2004
Plastic molded type semiconductor device and fabrication process thereof
RENESAS TECH CORP2 citations63
US7445969B2Nov 4, 2008
Method of manufacturing a semiconductor device
RENESAS TECH CORP4 citations62
US7288440B2Oct 30, 2007
Method of manufacturing a semiconductor device
RENESAS TECH CORP4 citations62
US7678706B2Mar 16, 2010
Method of manufacturing a semiconductor device
RENESAS TECH CORP0 citations52
US6791182B2Sep 14, 2004
Semiconductor device
RENESAS TECH CORP0 citations41
HITACHI LTD
4 patentsUS6291273B1Sep 18, 2001
Plastic molded type semiconductor device and fabrication process thereof
HITACHI LTD208 citations99
US6596561B2Jul 22, 2003
Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanical strength during manufacture
HITACHI LTD65 citations96
US6552437B1Apr 22, 2003
Semiconductor device and method of manufacture thereof
HITACHI LTD18 citations92
US6943456B2Sep 13, 2005
Plastic molded type semiconductor device and fabrication process thereof
HITACHI LTD6 citations74
HITACHI ULSI SYS CO LTD
3 patentsUS6900551B2May 31, 2005
Semiconductor device with alternate bonding wire arrangement
HITACHI ULSI SYS CO LTD28 citations92
US6989334B2Jan 24, 2006
Manufacturing method of a semiconductor device
HITACHI ULSI SYS CO LTD6 citations74
US7247576B2Jul 24, 2007
Method of manufacturing a semiconductor device
HITACHI ULSI SYS CO LTD2 citations63