Inventor

GAUDIN GWELTAZ

FR20 patents

⚠️ This page may combine multiple inventors who share the name “GAUDIN GWELTAZ”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GAUDIN GWELTAZ

SOITEC SILICON ON INSULATOR

Process for bonding two substrates

Method for molecular adhesion bonding with compensation for radial misalignment

Substrate having a charged zone in an insulating buried layer

Hybrid structure for a surface acoustic wave device

Method for producing a donor substrate for creating a three-dimensional integrated structure, and method for producing such an integrated structure

Process for fabricating a heterostructure limiting the formation of defects

Method for manufacturing a semiconductor structure

Method for producing a composite structure comprising a thin monocristalline layer on a carrier substrate

3D integrated heterostructures having low-temperature bonded interfaces with high bonding energy

Method for producing composite structure with metal/metal bonding

Method for transferring a layer comprising a compressive stress layer and related structures

GAUDIN GWELTAZ

Method for molecular adhesion bonding with compensation for radial misalignment

Method for transferring a monocrystalline semiconductor layer onto a support substrate

Low-temperature bonding process

BROEKAART MARCEL

Direct bonding method with reduction in overlay misalignment

CASTEX ARNAUD

Surface treatment for molecular bonding

SONY SEMICONDUCTOR SOLUTIONS CORP

Apparatus for molecular adhesion bonding with compensation for radial misalignment

SHAHEEN MOHAMAD

Substrate having a charged zone in an insulating buried layer

COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Method for producing a semiconductor structure comprising an interface region including agglomerates

COMMISSARIAT ENERGIE ATOMIQUE

Method for sealing cavities using membranes