P

Inventor

USUI TATEHITO

JP65 patents
⚠️ This page may combine multiple inventors who share the name “USUI TATEHITO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI LTD

30 patents
US5242539ASep 7, 1993

Plasma treatment method and apparatus

HITACHI LTD602 citations99
US6755932B2Jun 29, 2004

Plasma processing system and apparatus and a sample processing method

HITACHI LTD290 citations98
US6503364B1Jan 7, 2003

Plasma processing apparatus

HITACHI LTD92 citations97
US6815228B2Nov 9, 2004

Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring method

HITACHI LTD60 citations96
US6373681B2Apr 16, 2002

Electrostatic chuck, and method of and apparatus for processing sample using the chuck

HITACHI LTD67 citations96
US6243251B1Jun 5, 2001

Electrostatic chuck, and method of and apparatus for processing sample using the chuck

HITACHI LTD50 citations96
US5946184AAug 31, 1999

Electrostatic chuck, and method of and apparatus for processing sample

HITACHI LTD87 citations96
US5895586AApr 20, 1999

Plasma processing apparatus and plasma processing method in which a part of the processing chamber is formed using a pre-fluorinated material of aluminum

HITACHI LTD74 citations96
US6961131B2Nov 1, 2005

Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring method

HITACHI LTD24 citations93
US6903826B2Jun 7, 2005

Method and apparatus for determining endpoint of semiconductor element fabricating process

HITACHI LTD33 citations93
US6537832B2Mar 25, 2003

Measuring apparatus and film formation method

HITACHI LTD18 citations93
US6759253B2Jul 6, 2004

Process monitoring methods in a plasma processing apparatus, monitoring units, and a sample processing method using the monitoring units

HITACHI LTD27 citations92
US6427621B1Aug 6, 2002

Plasma processing device and plasma processing method

HITACHI LTD42 citations92
US6750977B2Jun 15, 2004

Apparatus for monitoring thickness of deposited layer in reactor and dry processing method

HITACHI LTD16 citations84
US6596551B1Jul 22, 2003

Etching end point judging method, etching end point judging device, and insulating film etching method using these methods

HITACHI LTD17 citations84
US5235399AAug 10, 1993

Temperature measuring apparatus utilizing radiation

HITACHI LTD20 citations79
US7411684B2Aug 12, 2008

Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring method

HITACHI LTD5 citations74
US7126697B2Oct 24, 2006

Method and apparatus for determining endpoint of semiconductor element fabricating process

HITACHI LTD5 citations74
US7009715B2Mar 7, 2006

Method and apparatus for determining endpoint of semiconductor element fabricating process and method and apparatus for processing member to be processed

HITACHI LTD7 citations74
US6967109B2Nov 22, 2005

Process monitoring methods in a plasma processing apparatus, monitoring units, and a sample processing method using the monitoring units

HITACHI LTD6 citations74
US6923885B2Aug 2, 2005

Plasma processing system and apparatus and a sample processing method

HITACHI LTD11 citations73
US11152237B2Oct 19, 2021

Substitute sample, method for determining control parameter of processing, and measurement system

HITACHI LTD2 citations72
US6716300B2Apr 6, 2004

Emission spectroscopic processing apparatus

HITACHI LTD8 citations72
US7230720B2Jun 12, 2007

Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring method

HITACHI LTD3 citations63
US6830649B2Dec 14, 2004

Apparatus and method for producing semiconductors

HITACHI LTD6 citations63
US6797529B2Sep 28, 2004

Processing apparatus with measuring unit and method

HITACHI LTD3 citations63
US11287782B2Mar 29, 2022

Computer, method for determining processing control parameter, substitute sample, measurement system, and measurement method

HITACHI LTD1 citations62
US7686917B2Mar 30, 2010

Plasma processing system and apparatus and a sample processing method

HITACHI LTD2 citations62
US7169254B2Jan 30, 2007

Plasma processing system and apparatus and a sample processing method

HITACHI LTD3 citations62
US6656752B1Dec 2, 2003

Ion current density measuring method and instrument, and semiconductor device manufacturing method

HITACHI LTD5 citations62

HITACHI HIGH TECH CORP

16 patents
US10008370B2Jun 26, 2018

Plasma processing apparatus and operation method thereof

HITACHI HIGH TECH CORP23 citations94
US10453695B2Oct 22, 2019

Plasma processing apparatus and plasma processing method

HITACHI HIGH TECH CORP7 citations84
US9934946B2Apr 3, 2018

Plasma processing apparatus and operating method of plasma processing apparatus

HITACHI HIGH TECH CORP9 citations84
US10672595B2Jun 2, 2020

Plasma processing apparatus and operation method thereof

HITACHI HIGH TECH CORP3 citations73
US7259866B2Aug 21, 2007

Semiconductor fabricating apparatus with function of determining etching processing state

HITACHI HIGH TECH CORP9 citations73
US10665516B2May 26, 2020

Etching method and plasma processing apparatus

HITACHI HIGH TECH CORP3 citations72
US6890771B2May 10, 2005

Plasma processing method using spectroscopic processing unit

HITACHI HIGH TECH CORP6 citations72
US11437289B2Sep 6, 2022

Plasma processing apparatus and plasma processing method

HITACHI HIGH TECH CORP4 citations71
US10020233B2Jul 10, 2018

Plasma processing apparatus and plasma processing method

HITACHI HIGH TECH CORP2 citations71
US9741629B2Aug 22, 2017

Plasma processing apparatus and plasma processing method

HITACHI HIGH TECH CORP3 citations71
US6835665B2Dec 28, 2004

Etching method of hardly-etched material and semiconductor fabricating method and apparatus using the method

HITACHI HIGH TECH CORP5 citations63
US11915951B2Feb 27, 2024

Plasma processing method

HITACHI HIGH TECH CORP1 citations62
US11239097B2Feb 1, 2022

Etching apparatus and etching method and detecting apparatus of film thickness

HITACHI HIGH TECH CORP1 citations62
US10971369B2Apr 6, 2021

Plasma processing method and plasma processing apparatus

HITACHI HIGH TECH CORP0 citations62
US12131964B2Oct 29, 2024

Plasma processing apparatus and plasma processing method

HITACHI HIGH TECH CORP0 citations61
US11424110B2Aug 23, 2022

Plasma processing apparatus and operational method thereof

HITACHI HIGH TECH CORP0 citations61

USUI TATEHITO

3 patents

HITACH HIGH TECHNOLOGIES CORP

1 patent

Showing the top 50 of 65 patents by PatentIndex Score.