Inventor

PARK YONG-SOON

KR13 patents

⚠️ This page may combine multiple inventors who share the name “PARK YONG-SOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SK HYNIX INC

4 patents

US11474939B2Oct 18, 2022

Memory device for improving speed of cache read operation and method of operating the same

SK HYNIX INC1 citations60

US10283174B2May 7, 2019

Memory system initializing page buffers and operating method thereof

SK HYNIX INC1 citations60

US11145338B2Oct 12, 2021

Semiconductor memory device and method of operating the same

SK HYNIX INC0 citations56

US11538518B2Dec 27, 2022

Memory device to suspend ROM operation and a method of operating the memory device

SK HYNIX INC0 citations41

SAMSUNG ELECTRONICS CO LTD

2 patents

US11066779B2Jul 20, 2021

Clothes dryer

SAMSUNG ELECTRONICS CO LTD9 citations83

US10563343B2Feb 18, 2020

Dryer and method for controlling the same

SAMSUNG ELECTRONICS CO LTD2 citations71

HYUNDAI KEFICO CORP

2 patents

US9617924B2Apr 11, 2017

Valve assembly

HYUNDAI KEFICO CORP1 citations50

US9771901B2Sep 26, 2017

Exhaust gas recirculation valve having cam structure for vehicle

HYUNDAI KEFICO CORP0 citations37

LEE DONG HWAN

1 patent

US8786230B2Jul 22, 2014

Apparatus and method of estimating inductance of permanent magnet synchronous motor

LEE DONG HWAN13 citations83

LG ELECTRONICS INC

1 patent

US9209707B2Dec 8, 2015

Three-level photovoltaic inverter configured for asymmetric control of DC-link voltages for separate MPPT driving

LG ELECTRONICS INC8 citations80

LEE TAE YOUNG

1 patent

US8586464B2Nov 19, 2013

Chemical mechanical polishing slurry composition for polishing phase-change memory device and method for polishing phase-change memory device using the same

LEE TAE YOUNG0 citations50

CHEIL IND INC

1 patent

US8828266B2Sep 9, 2014

CMP slurry composition and polishing method using the same

CHEIL IND INC0 citations49

SAMSUNG SDI CO LTD

1 patent

US10723916B2Jul 28, 2020

Organic film CMP slurry composition and polishing method using same

SAMSUNG SDI CO LTD0 citations40