Inventor
KUO CHENG-TA
TW22 patents
⚠️ This page may combine multiple inventors who share the name “KUO CHENG-TA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LEXTAR ELECTRONICS CORP
7 patentsUS12431476B2Sep 30, 2025
Pixel package, method for forming the same, and display device using the same
LEXTAR ELECTRONICS CORP0 citations62
US7935981B2May 3, 2011
Light emitting diode package
LEXTAR ELECTRONICS CORP3 citations62
US9447959B2Sep 20, 2016
Heat sink for electrical elements and light-emitting device containing thereof
LEXTAR ELECTRONICS CORP0 citations51
US10811578B1Oct 20, 2020
LED carrier and LED package having the same
LEXTAR ELECTRONICS CORP0 citations49
US9461213B2Oct 4, 2016
LED sub-mount and method for manufacturing light emitting device using the sub-mount
LEXTAR ELECTRONICS CORP1 citations49
US8012777B2Sep 6, 2011
Packaging process of light emitting diode
LEXTAR ELECTRONICS CORP1 citations42
US9153736B2Oct 6, 2015
Light-emitting diode device and method for fabricating the same
LEXTAR ELECTRONICS CORP0 citations38
EPISTAR CORP
5 patentsUS8008680B2Aug 30, 2011
Light-emitting diode device and manufacturing method thereof
EPISTAR CORP5 citations61
US7821026B2Oct 26, 2010
Light emitting diode device and manufacturing method therof
EPISTAR CORP3 citations61
US9276173B2Mar 1, 2016
Light-emitting device
EPISTAR CORP0 citations51
US7902562B2Mar 8, 2011
Light emitting diode device that includes a three dimensional cloud structure and manufacturing method thereof
EPISTAR CORP0 citations46
US7888162B2Feb 15, 2011
Method of manufacturing a photoelectronic device
EPISTAR CORP0 citations44
LEE CHIA-EN
3 patentsUS8278681B2Oct 2, 2012
Light-emitting diode package and wafer-level packaging process of light-emitting diode
LEE CHIA-EN7 citations81
US8445327B2May 21, 2013
Light-emitting diode package and wafer-level packaging process of light-emitting diode
LEE CHIA-EN0 citations49
US8415683B2Apr 9, 2013
Light emitting diode chip
LEE CHIA-EN0 citations38