Inventor

CHANG HONG-DA

TW21 patents

⚠️ This page may combine multiple inventors who share the name “CHANG HONG-DA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG HONG-DA

SILICONWARE PRECISION INDUSTRIES CO LTD

Semiconductor package having conductive pillars

Package structure and method for fabricating the same

Semiconductor package and fabrication method thereof

Electronic package with multiple electronic components spaced apart by grooves

Package structure and fabrication method thereof

Electronic package with multiple electronic components spaced apart by grooves

Electronic package, packaging substrate, and methods for fabricating the same

Electronic package, packaging substrate, and methods for fabricating the same

Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the same

Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the same

Fabrication method of wafer level package having a pressure sensor

Package structure having micro-electro-mechanical system element and method of fabrication the same

Package structure and fabrication method thereof

TOUCH MICRO SYSTEM TECH

White LED package structure having a silicon substrate and method of making the same

Light emitting diode structure and manufacturing method thereof

Light emitting diode structure

CHANG HONG-DA

Wafer level package having a pressure sensor and fabrication method thereof

Semiconductor package and method of fabricating the same

LIN CHEN-HAN

Package structure having MEMS elements and fabrication method thereof

Method for fabricating package structure having MEMS elements

LIN HUNG-YI

Method of making white LED package structure having a silicon substrate