Inventor
SHAN BOHAN
US6 patents
⚠️ This page may combine multiple inventors who share the name “SHAN BOHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
4 patentsUS12412868B2Sep 9, 2025
Microelectronic assemblies including interconnects with different solder materials
INTEL CORP0 citations60
US12354883B2Jul 8, 2025
Omni directional interconnect with magnetic fillers in mold matrix
INTEL CORP0 citations59
US12119326B2Oct 15, 2024
Microelectronic structures including bridges
INTEL CORP0 citations59
US12033930B2Jul 9, 2024
Selectively roughened copper architectures for low insertion loss conductive features
INTEL CORP0 citations47