Inventor · disambiguated record

Ryuki Horie

Also filed as: HORIE RYUKI

1 granted patent·0 citations·filing 2022–2022

11Inventor score

Technology areasB23K

Files withSENJU METAL INDUSTRY CO1

Top patents by PatentIndex Score

1 record

0165US11858071B2Solder alloy, solder paste, solder ball, solder preform, and solder jointSENJU METAL INDUSTRY CO·Filed 2022·Granted Jan 2, 2024·0 cites·5 claims

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