Inventor
HSIEH GEORGE
US21 patents
⚠️ This page may combine multiple inventors who share the name “HSIEH GEORGE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
16 patentsUS6822867B2Nov 23, 2004
Electronic assembly with solderable heat sink and methods of manufacture
INTEL CORP44 citations96
US7333335B2Feb 19, 2008
Using the wave soldering process to attach motherboard chipset heat sinks
INTEL CORP14 citations92
US7142429B2Nov 28, 2006
Heat sink and retaining clip assembly
INTEL CORP17 citations91
US6947283B2Sep 20, 2005
Heat sink and retaining clip assembly
INTEL CORP27 citations91
US6590771B2Jul 8, 2003
Heat sink assembly and method
INTEL CORP19 citations91
US6566611B2May 20, 2003
Anti-tombstoning structures and methods of manufacture
INTEL CORP51 citations89
US7161238B2Jan 9, 2007
Structural reinforcement for electronic substrate
INTEL CORP17 citations84
US6682802B2Jan 27, 2004
Selective PCB stiffening with preferentially oriented fibers
INTEL CORP9 citations73
US6594151B2Jul 15, 2003
Frame support for a printed board assembly
INTEL CORP8 citations73
US6875367B2Apr 5, 2005
Attaching components to a printed circuit card
INTEL CORP6 citations71
US6818155B2Nov 16, 2004
Attaching components to a printed circuit card
INTEL CORP5 citations71
US10098220B2Oct 9, 2018
Electronic device heat transfer system and related methods
INTEL CORP6 citations68
US7595991B2Sep 29, 2009
Using the wave soldering process to attach motherboard chipset heat sinks
INTEL CORP2 citations62
US7041357B2May 9, 2006
Selective PCB stiffening with preferentially oriented fibers
INTEL CORP4 citations62
US6878305B2Apr 12, 2005
Attaching components to a printed circuit card
INTEL CORP2 citations60
US6535383B2Mar 18, 2003
Clamshell heatsink
INTEL CORP5 citations59