Inventor

CHOI SAMUEL S

US44 patents

⚠️ This page may combine multiple inventors who share the name “CHOI SAMUEL S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHOI SAMUEL S

IBM

Interconnect scaling method including forming dielectric layer over subtractively etched first conductive layer and forming second conductive material on dielectric layer

Subtractive etch interconnects

Interconnect structure having subtractive etch feature and damascene feature

Interconnect structure having subtractive etch feature and damascene feature

Interconnect structure having substractive etch feature and damascene feature

High performance refractory metal / copper interconnects to eliminate electromigration

Selective local metal cap layer formation for improved electromigration behavior

Graphene and metal interconnects with reduced contact resistance

Graphene and metal interconnects

E-fuse with hybrid metallization

E-fuse structures and methods of manufacture

Electronic fuse having a damaged region

Electronic fuse vias in interconnect structures

Via reactive ion etching process

Back-end electrically programmable fuse

Selective local metal cap layer formation for improved electromigration behavior

Modified via bottom for beol via efuse

Profile control in interconnect structures

Selective local metal cap layer formation for improved electromigration behavior

Methods of manufacturing semiconductor structures using RIE process

Selective local metal cap layer formation for improved electromigration behavior

Electronic fuse vias in interconnect structures

Modified via bottom for BEOL via efuse

Via-fuse with low dielectric constant

Electronic fuse with resistive heater

GLOBALFOUNDRIES INC

Integration process to form microelectronic or micromechanical structures

Structure with air gap crack stop

Metal fuse structure for improved programming capability

Graphene-metal E-fuse

Self aligned via fuse

Method of forming microelectronic or micromechanical structures

Hybrid graphene-metal interconnect structures

Self-aligned via fuse

Forming air gap

BONILLA GRISELDA

Metal fuse structure for improved programming capability

Method to resolve hollow metal defects in interconnects

E-fuse structures and methods of manufacture

BAO JUNJING

Back-end electrically programmable fuse

Electronic anti-fuse

YANG CHIH-CHAO

Method of fabricating a profile control in interconnect structures

AKINMADE-YUSUFF HAKEEM B S

Method for forming trenches having different widths and the same depth

CHOI SAMUEL S

Lateral-dimension-reducing metallic hard mask etch

BIOLSI PETER

Methods of manufacturing semiconductor structures using RIE process

FILIPPI RONALD G

Redundant via structure for metal fuse applications