Inventor

HERMANSEN RALPH D

US20 patents

⚠️ This page may combine multiple inventors who share the name “HERMANSEN RALPH D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HERMANSEN RALPH D

HUGHES AIRCRAFT CO

Flexible epoxy adhesive blend

Room-temperature stable, one-component, electrically-conductive, flexible epoxy adhesives

Frozen premix, fillet-holding urethane adhesives/sealants

Superior thermal transfer adhesive

Plateable structural adhesive for cyanate ester composites

Encapsulant of amine-cured epoxy resin blends

Low exotherm, low temperature curing, epoxy impregnants

Method of making an epoxy prepolymer curing agent

DELCO ELECTRONICS CORP

Hot melt conformal coating materials

Solder joint encapsulation material

Polybutadiene urethane potting material

Hot melt epoxy encapsulation material

Circuit assembly encapsulated with polybutadiene urethane

RAYTHEON CO

Adhesive of flexible epoxy resin and latent dihydrazide

Room-temperature stable, one-component, thermally-conductive, flexible epoxy adhesives

Epoxy-terminated prepolymer of polyepoxide and diamine with curing agent

Adhesive of epoxy resin, amine-terminated ban and conductive filler

Reworkable, thermally-conductive adhesives for electronic assemblies

HERMANSEN RALPH D

Method of bonding metals with a radio-opaque adhesive/sealant for void detection and product made

HUGHES ELECTRONICS CORP

Plateable structural adhesive for cyanate ester composites