Inventor
VENKATESWARAN MUTHIAH
US5 patents
Patents
5 patentsUS6888255B2May 3, 2005
Built-up bump pad structure and method for same
TEXAS INSTRUMENTS INC144 citations97
US6849944B2Feb 1, 2005
Using a supporting structure to control collapse of a die towards a die pad during a reflow process for coupling the die to the die pad
TEXAS INSTRUMENTS INC107 citations96
US6780673B2Aug 24, 2004
Method of forming a semiconductor device package using a plate layer surrounding contact pads
TEXAS INSTRUMENTS INC92 citations95
US7135765B2Nov 14, 2006
Semiconductor device package and method of making the same
TEXAS INSTRUMENTS INC12 citations81
US7084011B2Aug 1, 2006
Forming a chip package having a no-flow underfill
TEXAS INSTRUMENTS INC2 citations60