Inventor
DO HUONG
US8 patents
Patents
8 patentsUS6303871B1Oct 16, 2001
Degassing hole design for olga trace impedance
INTEL CORP28 citations89
US11335620B2May 17, 2022
Package inductor having thermal solution structures
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US11955426B2Apr 9, 2024
Package-integrated multi-turn coil embedded in a package magnetic core
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US11404364B2Aug 2, 2022
Multi-layer embedded magnetic inductor coil
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US11393751B2Jul 19, 2022
Package-integrated multi-turn coil embedded in a package magnetic core
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US12336196B2Jun 17, 2025
Magnetic core inductors on package substrates
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US11676950B2Jun 13, 2023
Via-in-via structure for high density package integrated inductor
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US12154710B2Nov 26, 2024
Package embedded magnetic power transformers for SMPS
INTEL CORP0 citations58