Inventor
YADA SHINSUKE
JP35 patents
⚠️ This page may combine multiple inventors who share the name “YADA SHINSUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SANDISK TECHNOLOGIES LLC
24 patentsUS10192878B1Jan 29, 2019
Three-dimensional memory device with self-aligned multi-level drain select gate electrodes
SANDISK TECHNOLOGIES LLC54 citations98
US10559582B2Feb 11, 2020
Three-dimensional memory device containing source contact to bottom of vertical channels and method of making the same
SANDISK TECHNOLOGIES LLC24 citations94
US10475804B1Nov 12, 2019
Three-dimensional memory device containing multilevel drain select gate isolation and methods of making the same
SANDISK TECHNOLOGIES LLC33 citations94
US10381450B1Aug 13, 2019
Three-dimensional memory device with self-aligned drain select level isolation structures and method of making thereof
SANDISK TECHNOLOGIES LLC22 citations94
US10297610B2May 21, 2019
Three-dimensional memory device having on-pitch drain select gate electrodes and method of making the same
SANDISK TECHNOLOGIES LLC26 citations93
US11393836B2Jul 19, 2022
Three-dimensional memory device with separated source-side lines and method of making the same
SANDISK TECHNOLOGIES LLC7 citations86
US11049568B1Jun 29, 2021
Three-dimensional memory device with depletion region position control and method of erasing same using gate induced leakage
SANDISK TECHNOLOGIES LLC17 citations86
US10600800B2Mar 24, 2020
Three-dimensional memory device containing multilevel drain select gate isolation and methods of making the same
SANDISK TECHNOLOGIES LLC15 citations86
US10236300B2Mar 19, 2019
On-pitch drain select level isolation structure for three-dimensional memory device and method of making the same
SANDISK TECHNOLOGIES LLC15 citations86
US11121153B1Sep 14, 2021
Three-dimensional memory devices containing structures for controlling gate-induced drain leakage current and method of making the same
SANDISK TECHNOLOGIES LLC9 citations85
US10957680B2Mar 23, 2021
Semiconductor die stacking using vertical interconnection by through-dielectric via structures and methods for making the same
SANDISK TECHNOLOGIES LLC18 citations85
US9716062B2Jul 25, 2017
Multilevel interconnect structure and methods of manufacturing the same
SANDISK TECHNOLOGIES LLC10 citations84
US10381229B2Aug 13, 2019
Three-dimensional memory device with straddling drain select electrode lines and method of making thereof
SANDISK TECHNOLOGIES LLC9 citations83
US11935784B2Mar 19, 2024
Three-dimensional memory device containing self-aligned bit line contacts and methods for forming the same
SANDISK TECHNOLOGIES LLC4 citations73
US11889684B2Jan 30, 2024
Three-dimensional memory device with separated source-side lines and method of making the same
SANDISK TECHNOLOGIES LLC2 citations73
US11501835B2Nov 15, 2022
Three-dimensional memory device and method of erasing thereof from a source side
SANDISK TECHNOLOGIES LLC4 citations73
US10692884B2Jun 23, 2020
Three-dimensional memory device including bottle-shaped memory stack structures and drain-select gate electrodes having cylindrical portions
SANDISK TECHNOLOGIES LLC4 citations73
US9876027B2Jan 23, 2018
Three dimensional NAND device with channel located on three sides of lower select gate and method of making thereof
SANDISK TECHNOLOGIES LLC4 citations73
US12588208B2Mar 24, 2026
Three-dimensional memory device containing insulated gate located over a top source layer for applying GIDL erase voltage and method for manufacturing the same
SANDISK TECHNOLOGIES LLC0 citations62
USRE49165EAug 9, 2022
On-pitch drain select level isolation structure for three-dimensional memory device and method of making the same
SANDISK TECHNOLOGIES LLC0 citations62
US11758718B2Sep 12, 2023
Three dimensional memory device containing truncated channels and method of operating the same with different erase voltages for different bit lines
SANDISK TECHNOLOGIES LLC1 citations61
US11882702B2Jan 23, 2024
Lateral transistors for selecting blocks in a three-dimensional memory array and methods for forming the same
SANDISK TECHNOLOGIES LLC0 citations52
US12108597B2Oct 1, 2024
Three-dimensional memory device containing a pillar contact between channel and source and methods of making the same
SANDISK TECHNOLOGIES LLC0 citations50
US11626415B2Apr 11, 2023
Lateral transistors for selecting blocks in a three-dimensional memory array and methods for forming the same
SANDISK TECHNOLOGIES LLC0 citations49
SANDISK TECHNOLOGIES INC
9 patentsUS9449983B2Sep 20, 2016
Three dimensional NAND device with channel located on three sides of lower select gate and method of making thereof
SANDISK TECHNOLOGIES INC49 citations98
US9356034B1May 31, 2016
Multilevel interconnect structure and methods of manufacturing the same
SANDISK TECHNOLOGIES INC51 citations98
US9356043B1May 31, 2016
Three-dimensional memory devices containing memory stack structures with position-independent threshold voltage
SANDISK TECHNOLOGIES INC62 citations98
US9548313B2Jan 17, 2017
Method of making a monolithic three dimensional NAND string using a select gate etch stop layer
SANDISK TECHNOLOGIES INC25 citations94
US9754956B2Sep 5, 2017
Uniform thickness blocking dielectric portions in a three-dimensional memory structure
SANDISK TECHNOLOGIES INC10 citations84
US9530787B2Dec 27, 2016
Batch contacts for multiple electrically conductive layers
SANDISK TECHNOLOGIES INC18 citations82
US9793288B2Oct 17, 2017
Methods of fabricating memory device with spaced-apart semiconductor charge storage regions
SANDISK TECHNOLOGIES INC4 citations73
US12461692B2Nov 4, 2025
Select gate bias gradation structure in NAND memory
SANDISK TECHNOLOGIES INC0 citations50
US12456521B2Oct 28, 2025
Sub-block separation in NAND memory through word line based selectors
SANDISK TECHNOLOGIES INC0 citations49
WESTERN DIGITAL TECH INC
2 patentsUS12507414B2Dec 23, 2025
Three-dimensional memory device with laterally separated source select electrodes and methods of forming the same
WESTERN DIGITAL TECH INC0 citations52
US12538489B2Jan 27, 2026
Three-dimensional memory device having controlled lateral isolation trench depth and methods of forming the same
WESTERN DIGITAL TECH INC0 citations49