Inventor
OKINA TERUO
JP14 patents
Patents
14 patentsUS11201107B2Dec 14, 2021
Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer
SANDISK TECHNOLOGIES LLC34 citations94
US11195781B2Dec 7, 2021
Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer
SANDISK TECHNOLOGIES LLC22 citations94
US11393836B2Jul 19, 2022
Three-dimensional memory device with separated source-side lines and method of making the same
SANDISK TECHNOLOGIES LLC7 citations86
US11508711B2Nov 22, 2022
Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer
SANDISK TECHNOLOGIES LLC7 citations85
US11631690B2Apr 18, 2023
Three-dimensional memory device including trench-isolated memory planes and method of making the same
SANDISK TECHNOLOGIES LLC10 citations84
US11322466B2May 3, 2022
Semiconductor die containing dummy metallic pads and methods of forming the same
SANDISK TECHNOLOGIES LLC12 citations84
US11889684B2Jan 30, 2024
Three-dimensional memory device with separated source-side lines and method of making the same
SANDISK TECHNOLOGIES LLC2 citations73
US11094704B2Aug 17, 2021
Method of forming a three-dimensional memory device and a driver circuit on opposite sides of a substrate
SANDISK TECHNOLOGIES LLC6 citations73
US11450624B2Sep 20, 2022
Semiconductor die including diffusion barrier layers embedding bonding pads and methods of forming the same
SANDISK TECHNOLOGIES LLC2 citations72
US11444039B2Sep 13, 2022
Semiconductor die including diffusion barrier layers embedding bonding pads and methods of forming the same
SANDISK TECHNOLOGIES LLC2 citations72
US11088076B2Aug 10, 2021
Bonding pads embedded in a dielectric diffusion barrier and having recessed metallic liners
SANDISK TECHNOLOGIES LLC5 citations72
US12457735B2Oct 28, 2025
Three-dimensional memory device containing etch stop metal plates for backside via structures and methods for forming the same
SANDISK TECHNOLOGIES LLC0 citations52
US12108597B2Oct 1, 2024
Three-dimensional memory device containing a pillar contact between channel and source and methods of making the same
SANDISK TECHNOLOGIES LLC0 citations50
US12256542B2Mar 18, 2025
Three-dimensional memory device containing a pillar contact between channel and source and methods of making the same
SANDISK TECHNOLOGIES LLC0 citations41