Inventor
TSAI CHENG-WEI
TW13 patents
⚠️ This page may combine multiple inventors who share the name “TSAI CHENG-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SOLID STATE SYSTEM CO LTD
10 patentsUS10250998B2Apr 2, 2019
Micro-electro-mechanical systems (MEMS) device and method for fabricating the MEMS
SOLID STATE SYSTEM CO LTD14 citations85
US10390145B1Aug 20, 2019
Micro electro mechanical system (MEMS) microphone
SOLID STATE SYSTEM CO LTD12 citations83
US9955268B2Apr 24, 2018
Micro-electrical-mechanical system (MEMS) microphone
SOLID STATE SYSTEM CO LTD2 citations73
US11312616B1Apr 26, 2022
Structure of micro-electro-mechanical-system microphone and method for fabricating the same
SOLID STATE SYSTEM CO LTD2 citations72
US10841710B1Nov 17, 2020
Package structure of micro-electro-mechanical-system microphone package and method for packaging the same
SOLID STATE SYSTEM CO LTD2 citations72
US11317220B2Apr 26, 2022
Structure of micro-electro-mechanical-system microphone
SOLID STATE SYSTEM CO LTD0 citations62
US11172287B2Nov 9, 2021
Structure of micro-electro-mechanical-system microphone and method for fabricating the same
SOLID STATE SYSTEM CO LTD1 citations62
US11498830B2Nov 15, 2022
Structure of micro-electro-mechanical-system microphone and method for fabricating the same
SOLID STATE SYSTEM CO LTD0 citations51
US10798493B2Oct 6, 2020
Micro-electro-mechanical systems (MEMS) device and method for fabricating the MEMS
SOLID STATE SYSTEM CO LTD0 citations51
US9264832B2Feb 16, 2016
Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level
SOLID STATE SYSTEM CO LTD0 citations51