Inventor

FITCH JOHN S

US51 patents

⚠️ This page may combine multiple inventors who share the name “FITCH JOHN S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FITCH JOHN S

PALO ALTO RES CT INC

Broad frequency band energy scavenger

Methods to make piezoelectric ceramic thick film array and single elements with a reusable single layer substrate structure

Low cost piezo printhead based on microfluidics in printed circuit board and screen-printed piezoelectrics

Method of fabricating an array of multi-electroded piezoelectric transducers for piezoelectric diaphragm structures

Methods for making thick film elements

Distributed multi-segmented reconfigurable traveling wave grids for separation of proteins in gel electrophoresis

Piezoelectric ceramic thick film element, array of elements, and devices

Methods to make piezoelectric ceramic thick film arrays and elements

Piezoelectric transducers utilizing sub-diaphragms

Traveling wave algorithms to focus and concentrate proteins in gel electrophoresis

Poling system for piezoelectric diaphragm structures

Piezoelectric transducers

Piezoelectric transducers and methods of manufacture

Sample manipulator

Piezoelectric diaphragm structure with outer edge electrode

Bio-ejector filling stops to facilitate efficient filling

Radially poled piezoelectric diaphragm structures

Energy scavengers which adjust their frequency by altering liquid distributions on a beam

Isoelectric focusing (IEF) of proteins with sequential and oppositely directed traveling waves in gel electrophoresis

Bio-ejector filling stops to facilitate efficient filling

Bio-ejector filling stops to facilitate efficient filling

DIGITAL EQUIPMENT CORP

Paddleless molded plastic semiconductor chip package

Wet micro-channel wafer chuck and cooling method

High performance substrate, electronic package and integrated circuit cooling process

Interleaved-fin thermal connector

Integrated thermal coupling for heat generating device

Thermosiphon for cooling a high power die

Integrated circuit protection by liquid encapsulation

Integrated thermal coupling for a heat generating device

Integrated thermal coupling for heat generating device

Semiconductor heat removal apparatus with non-uniform conductance

Integrated circuit protection by liquid encapsulation

Interleaved-fin thermal connector

Micro-channel wafer cooling chuck

High powered die with bus bars

Fixture and method for attaching components

Fixture and method for attaching components

XEROX CORP

Method and apparatus to achieve uniform ink temperatures in printheads

Apparatus and method for acoustic ink printing using a bilayer printhead configuration

Plated structures or components

Hand-propelled wand printer

Integrated printhead

Fluidic structures

REDWOOD MICROSYSTEMS INC

Integrated electrically operable normally closed valve

Integrated electrically operable micro-valve

CHAN HING WAH

Metal trace fabrication for optical element

Metal trace fabrication for optical element

COMPAQ COMPUTER CORP

Independently mounted cooling fins for a low-stress semiconductor package

(unassigned)

Magic keychain

BIEGELSEN DAVID K

Self-assembling structures for electrostatic extraction of pigments from liquid inks for marking