Inventor
HAMBURGEN WILLIAM R
US24 patents
⚠️ This page may combine multiple inventors who share the name “HAMBURGEN WILLIAM R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DIGITAL EQUIPMENT CORP
22 patentsUS5604376AFeb 18, 1997
Paddleless molded plastic semiconductor chip package
DIGITAL EQUIPMENT CORP338 citations99
US5203401AApr 20, 1993
Wet micro-channel wafer chuck and cooling method
DIGITAL EQUIPMENT CORP168 citations99
US5198753AMar 30, 1993
Integrated circuit test fixture and method
DIGITAL EQUIPMENT CORP171 citations99
US5787976AAug 4, 1998
Interleaved-fin thermal connector
DIGITAL EQUIPMENT CORP96 citations97
US5838065ANov 17, 1998
Integrated thermal coupling for heat generating device
DIGITAL EQUIPMENT CORP48 citations96
US5582242ADec 10, 1996
Thermosiphon for cooling a high power die
DIGITAL EQUIPMENT CORP81 citations96
US5130889AJul 14, 1992
Integrated circuit protection by liquid encapsulation
DIGITAL EQUIPMENT CORP86 citations96
US4995451AFeb 26, 1991
Evaporator having etched fiber nucleation sites and method of fabricating same
DIGITAL EQUIPMENT CORP57 citations96
US4966226AOct 30, 1990
Composite graphite heat pipe apparatus and method
DIGITAL EQUIPMENT CORP63 citations96
US4839774AJun 13, 1989
Apparatus and method for cooling electronic component packages using an array of directed nozzles fabricated in the circuit board
DIGITAL EQUIPMENT CORP51 citations96
US4800956AJan 31, 1989
Apparatus and method for removal of heat from packaged element
DIGITAL EQUIPMENT CORP77 citations96
US6034430AMar 7, 2000
Integrated thermal coupling for a heat generating device
DIGITAL EQUIPMENT CORP29 citations93
US5948689ASep 7, 1999
Integrated thermal coupling for heat generating device
DIGITAL EQUIPMENT CORP17 citations93
US5247426ASep 21, 1993
Semiconductor heat removal apparatus with non-uniform conductance
DIGITAL EQUIPMENT CORP46 citations93
US5243756ASep 14, 1993
Integrated circuit protection by liquid encapsulation
DIGITAL EQUIPMENT CORP39 citations93
US6138748AOct 31, 2000
Interleaved-fin thermal connector
DIGITAL EQUIPMENT CORP33 citations92
US5235211AAug 10, 1993
Semiconductor package having wraparound metallization
DIGITAL EQUIPMENT CORP35 citations92
US5115858AMay 26, 1992
Micro-channel wafer cooling chuck
DIGITAL EQUIPMENT CORP19 citations82
US5629840AMay 13, 1997
High powered die with bus bars
DIGITAL EQUIPMENT CORP13 citations74
US5445697AAug 29, 1995
Fixture and method for attaching components
DIGITAL EQUIPMENT CORP6 citations74
US5224263AJul 6, 1993
Gentle package extraction tool and method
DIGITAL EQUIPMENT CORP13 citations74
US5150197ASep 22, 1992
Die attach structure and method
DIGITAL EQUIPMENT CORP18 citations74