Inventor
GUPTA PAVAN
US24 patents
⚠️ This page may combine multiple inventors who share the name “GUPTA PAVAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SITIME CORP
19 patentsUS9821998B2Nov 21, 2017
Stacked-die MEMS resonator system
SITIME CORP9 citations92
US9371221B2Jun 21, 2016
Low-profile stacked-die MEMS resonator system
SITIME CORP11 citations92
US8941247B1Jan 27, 2015
Stacked die package for MEMS resonator system
SITIME CORP16 citations92
US8669664B2Mar 11, 2014
Stacked die package for MEMS resonator system
SITIME CORP12 citations92
US8022554B2Sep 20, 2011
Stacked die package for MEMS resonator system
SITIME CORP34 citations91
US11370656B2Jun 28, 2022
Stacked-die MEMS resonator
SITIME CORP4 citations84
US10913655B2Feb 9, 2021
Manufacturing of integrated circuit resonator
SITIME CORP4 citations84
US10723617B2Jul 28, 2020
Package structure for micromechanical resonator
SITIME CORP4 citations84
US10287162B2May 14, 2019
Low-profile stacked-die MEMS resonator system
SITIME CORP6 citations84
US11987495B2May 21, 2024
MEMS resonator system
SITIME CORP1 citations73
US11708264B2Jul 25, 2023
Stacked-die MEMS resonator
SITIME CORP1 citations73
US9440845B2Sep 13, 2016
Encapsulated microelectromechanical structure
SITIME CORP1 citations63
US12365582B2Jul 22, 2025
MEMS resonator integrated cicruit fabrication
SITIME CORP0 citations62
US11685650B2Jun 27, 2023
Microelectromechanical structure with bonded cover
SITIME CORP0 citations62
US10766768B2Sep 8, 2020
Encapsulated microelectromechanical structure
SITIME CORP0 citations52
US10450190B2Oct 22, 2019
Encapsulated microelectromechanical structure
SITIME CORP0 citations52
US10099917B2Oct 16, 2018
Encapsulated microelectromechanical structure
SITIME CORP0 citations52
US9758371B2Sep 12, 2017
Encapsulated microelectromechanical structure
SITIME CORP0 citations52
US9434608B2Sep 6, 2016
Wafer encapsulated microelectromechanical structure
SITIME CORP0 citations52