Inventor
LIM JOONSUNG
KR23 patents
Patents
23 patentsUS12057421B2Aug 6, 2024
Nonvolatile memory devices and data storage systems including the same
SAMSUNG ELECTRONICS CO LTD3 citations73
US11955470B2Apr 9, 2024
Semiconductor device and electronic system
SAMSUNG ELECTRONICS CO LTD5 citations73
US11967574B2Apr 23, 2024
Memory device and data storage system including the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US12550724B2Feb 10, 2026
Semiconductor device and massive data storage system including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12217800B2Feb 4, 2025
Semiconductor device and data storage system including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11935597B2Mar 19, 2024
Semiconductor device and data storage system including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11715684B2Aug 1, 2023
Semiconductor device and massive data storage system including the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US11581333B2Feb 14, 2023
Integrated circuit device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11251196B2Feb 15, 2022
Integrated circuit device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11895840B2Feb 6, 2024
Memory device
SAMSUNG ELECTRONICS CO LTD0 citations60
US11450684B2Sep 20, 2022
Memory device
SAMSUNG ELECTRONICS CO LTD0 citations60
US12402306B2Aug 26, 2025
Semiconductor device having peripheral circuit areas at both sides of substrate and data storage system including the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US12402317B2Aug 26, 2025
Semiconductor devices and data storage systems including the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US12389596B2Aug 12, 2025
Semiconductor device and data storage system including the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US12356626B2Jul 8, 2025
Semiconductor devices including capacitor electrodes
SAMSUNG ELECTRONICS CO LTD0 citations51
US12538842B2Jan 27, 2026
Three-dimensional storage device using wafer-to-wafer bonding
SAMSUNG ELECTRONICS CO LTD0 citations50
US12538481B2Jan 27, 2026
Semiconductor device and memory system including multiple conductive layers
SAMSUNG ELECTRONICS CO LTD0 citations50
US12414301B2Sep 9, 2025
Semiconductor device and data storage system including the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12363899B2Jul 15, 2025
Semiconductor devices and data storage systems including the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12160992B2Dec 3, 2024
Semiconductor device and electronic system including the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US11901321B2Feb 13, 2024
Three-dimensional (3D) storage device using wafer-to-wafer bonding
SAMSUNG ELECTRONICS CO LTD0 citations50
US12396174B2Aug 19, 2025
Semiconductor device and data storage system including the same
SAMSUNG ELECTRONICS CO LTD0 citations49
US12033706B2Jul 9, 2024
Method of operating nonvolatile memory device, nonvolatile memory device and memory controller performing the same
SAMSUNG ELECTRONICS CO LTD0 citations49