Inventor
ONISHI HIDEAKI
JP31 patents
⚠️ This page may combine multiple inventors who share the name “ONISHI HIDEAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DAI ICHI KOGYO SEIYAKU CO LTD
6 patentsUS7026386B2Apr 11, 2006
Flame-retardant styrene resin composition
DAI ICHI KOGYO SEIYAKU CO LTD13 citations84
US7468408B2Dec 23, 2008
Flame-retardant styrene resin composition
DAI ICHI KOGYO SEIYAKU CO LTD15 citations82
US6924332B2Aug 2, 2005
Flame retarded polyamide or polyester resin compositions
DAI ICHI KOGYO SEIYAKU CO LTD9 citations72
US6864343B2Mar 8, 2005
Brominated polyphenylene oxide and flame retardant employing the brominated polyphenylene oxide
DAI ICHI KOGYO SEIYAKU CO LTD3 citations63
US6924331B2Aug 2, 2005
Flame-retardant polyolefin resin composition
DAI ICHI KOGYO SEIYAKU CO LTD1 citations50
US6919391B2Jul 19, 2005
Flame-retardant polyolefin-resin composition
DAI ICHI KOGYO SEIYAKU CO LTD0 citations50
ONISHI HIDEAKI
6 patentsUS8668850B2Mar 11, 2014
Flame-retarded foamed plastic compositions and shaped articles
ONISHI HIDEAKI2 citations60
US9487707B2Nov 8, 2016
Flame retardant composition for flammable plastic materials comprising 2,4,6-tris(2,4,6-tribromophenoxy)-1,3,5-triazine and process for producing the same
ONISHI HIDEAKI0 citations51
US9187607B2Nov 17, 2015
Flame-retarded foamable styrene-based resin compositions
ONISHI HIDEAKI0 citations40
US9518168B2Dec 13, 2016
Polylactic acid resin composition and resin molded article thereof
ONISHI HIDEAKI0 citations39
US9518169B2Dec 13, 2016
Polylactic acid resin composition and resin molded article thereof
ONISHI HIDEAKI0 citations39
US9376546B2Jun 28, 2016
Polylactic acid resin composition and resin molded article thereof
ONISHI HIDEAKI0 citations39
NEC CORP
5 patentsUS5929490AJul 27, 1999
Semiconductor device with an improved body contact hole structure
NEC CORP30 citations92
US6160293ADec 12, 2000
Sub-quarter micron silicon-on-insulator MOS field effect transistor with deep silicide contact layers
NEC CORP7 citations74
US5981359ANov 9, 1999
Method of manufacturing semiconductor device having isolation film on SOI substrate
NEC CORP11 citations74
US5856693AJan 5, 1999
Semiconductor integrated circuit device containing MOS protection circuit
NEC CORP16 citations74
US6150202ANov 21, 2000
Method for fabricating semiconductor device
NEC CORP4 citations63
SCREEN HOLDINGS CO LTD
4 patentsUS12589596B2Mar 31, 2026
Inkjet printing apparatus
SCREEN HOLDINGS CO LTD0 citations52
US12319071B2Jun 3, 2025
Head replacement method, inkjet printing apparatus, and non-transitory computer-readable recording medium recording head replacement support program
SCREEN HOLDINGS CO LTD0 citations52
US11938720B2Mar 26, 2024
Printing apparatus having a splice portion
SCREEN HOLDINGS CO LTD0 citations50
US12552176B2Feb 17, 2026
Inkjet printing apparatus
SCREEN HOLDINGS CO LTD0 citations48
ATSUGI UNISIA CORP
3 patentsUS5203290AApr 20, 1993
Intake and/or exhaust-valve timing control sytem for internal combustion engine
ATSUGI UNISIA CORP27 citations92
US5117785AJun 2, 1992
Valve timing control device for internal combustion engine
ATSUGI UNISIA CORP26 citations92
US5203291AApr 20, 1993
Valve timing control system for internal combustion engine
ATSUGI UNISIA CORP18 citations73
MATSUSHITA ELECTRONICS CORP
2 patentsDAI-ICHI KOGYO SEIYAKU CO LTD
2 patentsUS9422410B2Aug 23, 2016
Flame-retardant foamed styrene resin composition
DAI-ICHI KOGYO SEIYAKU CO LTD2 citations56
US9481832B2Nov 1, 2016
Flame retardant composition for flammable plastic materials comprising 2,4,6-tris(2,4,6-tribromophenoxy)-1,3,5-triazine and process for producing the same
DAI-ICHI KOGYO SEIYAKU CO LTD0 citations52