Inventor
HUSAIN ANWAR
US33 patents
⚠️ This page may combine multiple inventors who share the name “HUSAIN ANWAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
18 patentsUS6575177B1Jun 10, 2003
Semiconductor substrate cleaning system
APPLIED MATERIALS INC83 citations98
US6474712B1Nov 5, 2002
Gripper for supporting substrate in a vertical orientation
APPLIED MATERIALS INC42 citations92
US6406359B1Jun 18, 2002
Apparatus for transferring semiconductor substrates using an input module
APPLIED MATERIALS INC28 citations92
US6516816B1Feb 11, 2003
Spin-rinse-dryer
APPLIED MATERIALS INC21 citations91
US10847347B2Nov 24, 2020
Edge ring assembly for a substrate support in a plasma processing chamber
APPLIED MATERIALS INC12 citations83
US12020977B2Jun 25, 2024
Lift pin assembly
APPLIED MATERIALS INC4 citations72
US10504765B2Dec 10, 2019
Electrostatic chuck assembly having a dielectric filler
APPLIED MATERIALS INC2 citations72
US12341048B2Jun 24, 2025
Porous plug for electrostatic chuck gas delivery
APPLIED MATERIALS INC1 citations62
US11488852B2Nov 1, 2022
Methods and apparatus for reducing high voltage arcing in semiconductor process chambers
APPLIED MATERIALS INC0 citations62
US11424096B2Aug 23, 2022
Temperature controlled secondary electrode for ion control at substrate edge
APPLIED MATERIALS INC0 citations62
US10930540B2Feb 23, 2021
Electrostatic chuck assembly having a dielectric filler
APPLIED MATERIALS INC0 citations62
US11171030B2Nov 9, 2021
Methods and apparatus for dechucking wafers
APPLIED MATERIALS INC0 citations61
US12562353B2Feb 24, 2026
Replaceable electrostatic chuck outer ring for edge arcing mitigation
APPLIED MATERIALS INC0 citations60
US11551916B2Jan 10, 2023
Sheath and temperature control of a process kit in a substrate processing chamber
APPLIED MATERIALS INC0 citations52
US7226514B2Jun 5, 2007
Spin-rinse-dryer
APPLIED MATERIALS INC1 citations51
US12211734B2Jan 28, 2025
Lift pin mechanism
APPLIED MATERIALS INC0 citations49
US12198903B2Jan 14, 2025
Plasma resistant arc preventative coatings for manufacturing equipment components
APPLIED MATERIALS INC0 citations47
US11551960B2Jan 10, 2023
Helical plug for reduction or prevention of arcing in a substrate support
APPLIED MATERIALS INC0 citations45
LAM RES CORP
7 patentsUS5671116ASep 23, 1997
Multilayered electrostatic chuck and method of manufacture thereof
LAM RES CORP116 citations98
US6140612AOct 31, 2000
Controlling the temperature of a wafer by varying the pressure of gas between the underside of the wafer and the chuck
LAM RES CORP54 citations96
US5880922AMar 9, 1999
Multilayered electrostatic chuck and method of manufacture thereof
LAM RES CORP48 citations96
US7743730B2Jun 29, 2010
Apparatus for an optimized plasma chamber grounded electrode assembly
LAM RES CORP32 citations92
US6303895B1Oct 16, 2001
Method and apparatus for controlling a temperature of a wafer
LAM RES CORP21 citations92
US5911833AJun 15, 1999
Method of in-situ cleaning of a chuck within a plasma chamber
LAM RES CORP49 citations90
US9905402B2Feb 27, 2018
Plasma processing chamber with a grounded electrode assembly
LAM RES CORP5 citations84
KHOLODENKO ARNOLD
5 patentsUS8261905B2Sep 11, 2012
Wafer carrier drive apparatus and method for operating the same
KHOLODENKO ARNOLD11 citations83
US8584613B2Nov 19, 2013
Single substrate processing head for particle removal using low viscosity fluid
KHOLODENKO ARNOLD2 citations60
US8557051B2Oct 15, 2013
Method for using generator for foam to clean substrate
KHOLODENKO ARNOLD0 citations51
US8161984B2Apr 24, 2012
Generator for foam to clean substrate
KHOLODENKO ARNOLD1 citations51
US8739805B2Jun 3, 2014
Confinement of foam delivered by a proximity head
KHOLODENKO ARNOLD0 citations38