Inventor

NAKANO MASATAKE

JP19 patents

⚠️ This page may combine multiple inventors who share the name “NAKANO MASATAKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NAKANO MASATAKE

SHINETSU HANDOTAI KK

Method for reclaiming delaminated wafer and reclaimed delaminated wafer

Method for manufacturing bonded wafer and bonded wafer manufactured thereby

Method for producing bonded wafer and bonded wafer

Method for reclaiming delaminated wafer and reclaimed delaminated wafer

Method of forming oxide film on an SOI layer and method of fabricating a bonded wafer

Method and apparatus for production of extremely thin SOI film substrate

Apparatus for production of extremely thin SOI film substrate

Method of fabricating soi substrate with uniform thin silicon film

Method of manufacturing an SOI wafer where COP&#39;s are eliminated within the base wafer

Production method for bonded substrates

Method of fabricating bonded wafer

Bonded wafer producing method and bonded wafer

Method for manufacturing SOI wafer including heat treatment in an oxidizing atmosphere

Method for producing bonded SOI wafer

Method for manufacturing a bonded SOI wafer

Method for manufacturing a bonded SOI wafer

SHARP KK

Portable information processing apparatus

Portable information processing apparatus

ISHIZUKA TOHRU

SOI wafer, semiconductor device, and method for manufacturing SOI wafer

Method of manufacturing an SOI wafer where COP's are eliminated within the base wafer