Inventor

MARKS JEFFREY

US75 patents

⚠️ This page may combine multiple inventors who share the name “MARKS JEFFREY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MARKS JEFFREY

APPLIED MATERIALS INC

Plasma reactor and processes using RF inductive coupling and scavenger temperature control

Selectivity for etching an oxide over a nitride

Plasma reactor using inductive RF coupling, and processes

Method for processing substrates using gaseous silicon scavenger

Process used in an RF coupled plasma reactor

Silicon scavenger in an inductively coupled RF plasma reactor

Etching titanium nitride using carbon-fluoride and carbon-oxide gas

Electrostatic chuck for high power plasma processing

Plasma reactor using inductive RF coupling, and processes

Magnetic confinement in a plasma reactor having an RF bias electrode

Plasma etch processes

Plasma reactor with heated source of a polymer-hardening precursor material

Plasma reactor with heated source of a polymer-hardening precursor material

Plasma etch apparatus with heated scavenging surfaces

Electrostatic chuck usable in high density plasma

Plasma etch apparatus with heated scavenging surfaces

Method for planarizing an integrated circuit structure using low melting inorganic material

Method and apparatus for removing a substrate from a polishing pad in a chemical mechanical polishing system

Electrostatic chuck usable in high density plasma

Process for etching oxides in an electromagnetically coupled planar plasma apparatus

Process for etching oxides in an electromagnetically coupled planar plasma apparatus

Method for planarizing an integrated circuit structure using low melting inorganic material and flowing while depositing

Plasma reactor with heated source of a polymer-hardening precursor material

High temperature silicon surface providing high selectivity in an oxide etch process

Apparatus and method for distribution of slurry in a chemical mechanical polishing system

Oxide etch process with high selectivity to nitride suitable for use on surfaces of uneven topography

High selectivity oxide etch process for integrated circuit structures

Apparatus and method for distribution of slurry in a chemical mechanical polishing system

Plasma reactor with heated source of a polymer-hardening precursor material

Plasma reactor with heated source of a polymer-hardening precursor material

LAM RES CORP

Vacuum-integrated hardmask processes and apparatus

Vacuum-integrated hardmask processes and apparatus

Dry plasma etch method to pattern MRAM stack

Reduction of feature critical dimensions using multiple masks

Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)

Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)

Method to etch non-volatile metal materials

Method to etch non-volatile metal materials

Photoresist development with halide chemistries

Vacuum-integrated hardmask processes and apparatus

Vacuum-integrated hardmask processes and apparatus

Dry plasma etch method to pattern MRAM stack

Integrating atomic scale processes: ALD (atomic layer deposition) and ale (atomic layer etch)

Atomic layer etching of tungsten and other metals

CVD based metal/semiconductor OHMIC contact for high volume manufacturing applications

Enhanced resist strip in a dielectric etcher using downstream plasma

Atomic layer etching of GaN and other III-V materials

Method and apparatus for detecting endpoint during plasma etching of thin films

Multiple frequency plasma processor method and apparatus

Dry plasma etch method to pattern MRAM stack