Inventor
GROECHEL DAVID W
US37 patents
Patents
37 patentsUS5888414AMar 30, 1999
Plasma reactor and processes using RF inductive coupling and scavenger temperature control
APPLIED MATERIALS INC203 citations99
US5423945AJun 13, 1995
Selectivity for etching an oxide over a nitride
APPLIED MATERIALS INC220 citations99
US6518195B1Feb 11, 2003
Plasma reactor using inductive RF coupling, and processes
APPLIED MATERIALS INC162 citations98
US6444137B1Sep 3, 2002
Method for processing substrates using gaseous silicon scavenger
APPLIED MATERIALS INC127 citations98
US6077384AJun 20, 2000
Plasma reactor having an inductive antenna coupling power through a parallel plate electrode
APPLIED MATERIALS INC237 citations98
US6068784AMay 30, 2000
Process used in an RF coupled plasma reactor
APPLIED MATERIALS INC173 citations98
US5556501ASep 17, 1996
Silicon scavenger in an inductively coupled RF plasma reactor
APPLIED MATERIALS INC396 citations98
US6623596B1Sep 23, 2003
Plasma reactor having an inductive antenna coupling power through a parallel plate electrode
APPLIED MATERIALS INC84 citations97
US6545420B1Apr 8, 2003
Plasma reactor using inductive RF coupling, and processes
APPLIED MATERIALS INC135 citations97
US6488807B1Dec 3, 2002
Magnetic confinement in a plasma reactor having an RF bias electrode
APPLIED MATERIALS INC145 citations97
US6251792B1Jun 26, 2001
Plasma etch processes
APPLIED MATERIALS INC122 citations97
US6218312B1Apr 17, 2001
Plasma reactor with heated source of a polymer-hardening precursor material
APPLIED MATERIALS INC61 citations96
US5770099AJun 23, 1998
Plasma etch apparatus with heated scavenging surfaces
APPLIED MATERIALS INC54 citations96
US5477975ADec 26, 1995
Plasma etch apparatus with heated scavenging surfaces
APPLIED MATERIALS INC86 citations96
US5292399AMar 8, 1994
Plasma etching apparatus with conductive means for inhibiting arcing
APPLIED MATERIALS INC123 citations95
US6053801AApr 25, 2000
Substrate polishing with reduced contamination
APPLIED MATERIALS INC58 citations93
US5308417AMay 3, 1994
Uniformity for magnetically enhanced plasma chambers
APPLIED MATERIALS INC63 citations93
US6468136B1Oct 22, 2002
Tungsten CMP with improved alignment mark integrity, reduced edge residue, and reduced retainer ring notching
APPLIED MATERIALS INC30 citations92
US6440866B1Aug 27, 2002
Plasma reactor with heated source of a polymer-hardening precursor material
APPLIED MATERIALS INC22 citations92
US6399514B1Jun 4, 2002
High temperature silicon surface providing high selectivity in an oxide etch process
APPLIED MATERIALS INC30 citations92
US6171974B1Jan 9, 2001
High selectivity oxide etch process for integrated circuit structures
APPLIED MATERIALS INC23 citations92
US6036877AMar 14, 2000
Plasma reactor with heated source of a polymer-hardening precursor material
APPLIED MATERIALS INC30 citations92
US5021121AJun 4, 1991
Process for RIE etching silicon dioxide
APPLIED MATERIALS INC75 citations92
US5925212AJul 20, 1999
Apparatus and method for attaining repeatable temperature versus time profiles for plasma heated interactive parts used in mass production plasma processing
APPLIED MATERIALS INC43 citations90
US6083412AJul 4, 2000
Plasma etch apparatus with heated scavenging surfaces
APPLIED MATERIALS INC13 citations74
US12318868B2Jun 3, 2025
Texturizing a surface without bead blasting
APPLIED MATERIALS INC0 citations62
US11519071B2Dec 6, 2022
Method for fabricating chamber parts
APPLIED MATERIALS INC0 citations61
US11378511B2Jul 5, 2022
Methods and apparatus for detecting corrosion of conductive objects
APPLIED MATERIALS INC0 citations59
US11261533B2Mar 1, 2022
Aluminum plating at low temperature with high efficiency
APPLIED MATERIALS INC0 citations59
US12131934B2Oct 29, 2024
Semiconductor substrate support leveling apparatus
APPLIED MATERIALS INC1 citations58
US11848218B2Dec 19, 2023
Semiconductor chamber component cleaning systems
APPLIED MATERIALS INC0 citations53
US12327738B2Jun 10, 2025
Integrated semiconductor part cleaning system
APPLIED MATERIALS INC0 citations51
US10857625B2Dec 8, 2020
Texturizing a surface without bead blasting
APPLIED MATERIALS INC0 citations51
US10434604B2Oct 8, 2019
Texturizing a surface without bead blasting
APPLIED MATERIALS INC0 citations51
US11776822B2Oct 3, 2023
Wet cleaning of electrostatic chuck
APPLIED MATERIALS INC0 citations50
US11661652B2May 30, 2023
Wet cleaning inside of gasline of semiconductor process equipment
APPLIED MATERIALS INC0 citations47
US11710647B2Jul 25, 2023
Hyperbaric clean method and apparatus for cleaning semiconductor chamber components
APPLIED MATERIALS INC0 citations43