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Inventor
LEEBRICK DAVID H
US
2 patents
Patents
2 patents
US5516625A
May 14, 1996
Fill and etchback process using dual photoresist sacrificial layer and two-step etching process for planarizing oxide-filled shallow trench structure
HARRIS CORP
52 citations
85
US4566796A
Jan 28, 1986
Method of determining position on a wafer
HARRIS CORP
4 citations
55