P

Inventor

OKABE SHUHICHI

JP9 patents
⚠️ This page may combine multiple inventors who share the name “OKABE SHUHICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

4 patents
US7707715B2May 4, 2010

Method of fabricating multilayer printed circuit board

SAMSUNG ELECTRO MECH18 citations83
US7824838B2Nov 2, 2010

Method of manufacturing printed circuit board

SAMSUNG ELECTRO MECH3 citations62
US7516545B2Apr 14, 2009

Method of manufacturing printed circuit board having landless via hole

SAMSUNG ELECTRO MECH3 citations62
US7971352B2Jul 5, 2011

Method of manufacturing printed circuit board

SAMSUNG ELECTRO MECH5 citations58

IBM

3 patents
US6184479B1Feb 6, 2001

Multilayer printed circuit board having a concave metal portion

IBM21 citations90
US6105243AAug 22, 2000

Method of fabricating multilayer printed circuit board

IBM12 citations71
US5766825AJun 16, 1998

Method of forming a resin laying in a surface laminated circuit

IBM7 citations68

OKABE SHUHICHI

2 patents
US8633392B2Jan 21, 2014

Circuit board with high-density circuit patterns

OKABE SHUHICHI0 citations46
US8124880B2Feb 28, 2012

Circuit board and method for manufacturing thereof

OKABE SHUHICHI0 citations46