Inventor
MATSUDA KAZUHIRO
JP16 patents
⚠️ This page may combine multiple inventors who share the name “MATSUDA KAZUHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TATSUTA ELECTRIC WIRE & CABLE CO LTD
7 patentsUS10893603B2Jan 12, 2021
Heat dissipation substrate, heat dissipation circuit structure body, and method for manufacturing the same
TATSUTA ELECTRIC WIRE & CABLE CO LTD2 citations70
US11912897B2Feb 27, 2024
Electroconductive coating material and method for producing shielded package using said electroconductive coating material
TATSUTA ELECTRIC WIRE & CABLE CO LTD0 citations58
US10259952B2Apr 16, 2019
Conductive coating material for shielding electronic component package and method for producing shielded package
TATSUTA ELECTRIC WIRE & CABLE CO LTD0 citations51
US11191198B2Nov 30, 2021
Shield package
TATSUTA ELECTRIC WIRE & CABLE CO LTD0 citations50
US11414554B2Aug 16, 2022
Conductive coating material and production method for shielded package using conductive coating material
TATSUTA ELECTRIC WIRE & CABLE CO LTD0 citations49
US11370926B2Jun 28, 2022
Conductive coating material and production method for shielded package using conductive coating material
TATSUTA ELECTRIC WIRE & CABLE CO LTD0 citations49
US11236227B2Feb 1, 2022
Heat dissipation material adhering composition, heat dissipation material having adhesive, inlay substrate, and method for manufacturing same
TATSUTA ELECTRIC WIRE & CABLE CO LTD0 citations49