Inventor
GOLAND DAVID B
PL23 patents
Patents
23 patentsUS5480503AJan 2, 1996
Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof
IBM127 citations97
US6262390B1Jul 17, 2001
Repair process for aluminum nitride substrates
IBM66 citations96
US5981310ANov 9, 1999
Multi-chip heat-sink cap assembly
IBM59 citations95
US5177594AJan 5, 1993
Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance
IBM137 citations95
US6373133B1Apr 16, 2002
Multi-chip module and heat-sink cap combination
IBM34 citations92
US5292477AMar 8, 1994
Supersaturation method for producing metal powder with a uniform distribution of dispersants method of uses thereof and structures fabricated therewith
IBM20 citations92
US5147484ASep 15, 1992
Method for producing multi-layer ceramic substrates with oxidation resistant metalization
IBM21 citations82
US6352014B1Mar 5, 2002
Method for making punches using multi-layer ceramic technology
IBM12 citations74
US5194196AMar 16, 1993
Hermetic package for an electronic device and method of manufacturing same
IBM8 citations74
US5169310ADec 8, 1992
Hermetic package for an electronic device and method of manufacturing same
IBM10 citations74
US6096565AAug 1, 2000
Multi-layer glass ceramic module with superconductor wiring
IBM14 citations72
US6002951ADec 14, 1999
Multi-layer ceramic substrate having high TC superconductor circuitry
IBM5 citations72
US5552107ASep 3, 1996
Aluminum nitride body having graded metallurgy
IBM9 citations72
US5552232ASep 3, 1996
Aluminum nitride body having graded metallurgy
IBM4 citations72
US6004624ADec 21, 1999
Method for the controlling of certain second phases in aluminum nitride
IBM5 citations71
US5759669AJun 2, 1998
Apparatus and method for screening green sheet with via hole using porous backing material
IBM14 citations69
US6652956B2Nov 25, 2003
X-ray printing personalization technique
IBM2 citations63
US5245136ASep 14, 1993
Hermetic package for an electronic device
IBM4 citations63
US6200373B1Mar 13, 2001
Method for controlling of certain second phases in aluminum nitride
IBM3 citations60
US5635000AJun 3, 1997
Method for screening using electrostatic adhesion
IBM3 citations59
US5891543AApr 6, 1999
Apparatus and method for screening using electrostatic adhesion
IBM3 citations58
US6638681B2Oct 28, 2003
X-ray printing personalization technique
IBM0 citations52
US6306528B1Oct 23, 2001
Method for the controlling of certain second phases in aluminum nitride
IBM0 citations50