Inventor
COLBERT JOHN LEE
US21 patents
⚠️ This page may combine multiple inventors who share the name “COLBERT JOHN LEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
20 patentsUS6385044B1May 7, 2002
Heat pipe heat sink assembly for cooling semiconductor chips
IBM88 citations97
US6480391B1Nov 12, 2002
Modular cage for an electronic component
IBM101 citations95
US7606033B2Oct 20, 2009
Mounting a heat sink in thermal contact with an electronic component
IBM18 citations92
US7486516B2Feb 3, 2009
Mounting a heat sink in thermal contact with an electronic component
IBM32 citations92
US7435622B2Oct 14, 2008
High performance reworkable heatsink and packaging structure with solder release layer and method of making
IBM19 citations92
US7342306B2Mar 11, 2008
High performance reworkable heatsink and packaging structure with solder release layer
IBM22 citations92
US6449155B1Sep 10, 2002
Land grid array subassembly for multichip modules
IBM48 citations92
US7293994B2Nov 13, 2007
Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member
IBM15 citations91
US7944698B2May 17, 2011
Mounting a heat sink in thermal contact with an electronic component
IBM9 citations84
US6988533B2Jan 24, 2006
Method and apparatus for mounting a heat transfer apparatus upon an electronic component
IBM11 citations84
US7345881B2Mar 18, 2008
Non-influencing fastener for mounting a heat sink in contact with an electronic component
IBM15 citations83
US6561554B2May 13, 2003
Simplified latch and associated assembly method
IBM14 citations81
US7517230B2Apr 14, 2009
Customizable backer for achieving consistent loading and engagement of array package connections
IBM6 citations74
US7399185B2Jul 15, 2008
Customizable backer for achieving consistent loading and engagement of array package connections
IBM6 citations74
US7071720B2Jul 4, 2006
Method and apparatus for managing aligning and coupling of a land grid array interposer for a field replacement unit
IBM2 citations62
US6792375B2Sep 14, 2004
Apparatus, system, and method of determining loading characteristics on an integrated circuit module
IBM5 citations62
US7765693B2Aug 3, 2010
Electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member
IBM5 citations61
US7339266B2Mar 4, 2008
Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
IBM4 citations60
US7731146B2Jun 8, 2010
Dual swivel in-line load node lock mechanism
IBM3 citations57
US7550840B2Jun 23, 2009
Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
IBM0 citations50