Inventor
CORBIN JR JOHN SAUNDERS
US20 patents
Patents
20 patentsUS6385044B1May 7, 2002
Heat pipe heat sink assembly for cooling semiconductor chips
IBM88 citations97
US5738531AApr 14, 1998
Self-alligning low profile socket for connecting ball grid array devices through a dendritic interposer
IBM104 citations96
US7453279B2Nov 18, 2008
Functional and stress testing of LGA devices
IBM30 citations95
US6180874B1Jan 30, 2001
High density heatsink attachment and method therefor
IBM48 citations94
US6229708B1May 8, 2001
Multi-axis microprocess or docking mechanism
IBM61 citations93
US6449155B1Sep 10, 2002
Land grid array subassembly for multichip modules
IBM48 citations92
US5713690AFeb 3, 1998
Apparatus for attaching heatsinks
IBM43 citations91
US6911836B2Jun 28, 2005
Apparatus for functional and stress testing of exposed chip land grid array devices
IBM26 citations89
US6278615B1Aug 21, 2001
Heatsink grounding spring and shield apparatus
IBM34 citations88
US7345881B2Mar 18, 2008
Non-influencing fastener for mounting a heat sink in contact with an electronic component
IBM15 citations83
US7135877B2Nov 14, 2006
Temperature and condensation control system for functional tester
IBM11 citations82
US6792375B2Sep 14, 2004
Apparatus, system, and method of determining loading characteristics on an integrated circuit module
IBM5 citations62
US7479796B2Jan 20, 2009
Functional and stress testing of LGA devices
IBM1 citations61
US7466155B2Dec 16, 2008
Functional and stress testing of LGA devices
IBM0 citations51
US7463017B2Dec 9, 2008
Functional and stress testing of LGA devices
IBM0 citations51
US7456644B2Nov 25, 2008
Functional and stress testing of LGA devices
IBM0 citations51
US7425822B2Sep 16, 2008
Functional and stress testing of LGA devices
IBM0 citations51
US7423440B2Sep 9, 2008
Functional and stress testing of LGA devices
IBM0 citations51
US7405583B2Jul 29, 2008
Functional and stress testing of LGA devices
IBM0 citations51
US7352200B2Apr 1, 2008
Functional and stress testing of LGA devices
IBM0 citations51