Inventor
HAMILTON ROGER DUANE
US17 patents
Patents
17 patentsUS6385044B1May 7, 2002
Heat pipe heat sink assembly for cooling semiconductor chips
IBM88 citations97
US5870286AFeb 9, 1999
Heat sink assembly for cooling electronic modules
IBM92 citations97
US6061240AMay 9, 2000
Push pin assembly for heat sink for cooling electronic modules
IBM61 citations95
US5978223ANov 2, 1999
Dual heat sink assembly for cooling multiple electronic modules
IBM87 citations95
US5940266AAug 17, 1999
Bi-directional cooling arrangement for use with an electronic component enclosure
IBM76 citations94
US7606033B2Oct 20, 2009
Mounting a heat sink in thermal contact with an electronic component
IBM18 citations92
US7486516B2Feb 3, 2009
Mounting a heat sink in thermal contact with an electronic component
IBM32 citations92
US6449155B1Sep 10, 2002
Land grid array subassembly for multichip modules
IBM48 citations92
US7777329B2Aug 17, 2010
Heatsink apparatus for applying a specified compressive force to an integrated circuit device
IBM24 citations91
US7293994B2Nov 13, 2007
Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member
IBM15 citations91
US7944698B2May 17, 2011
Mounting a heat sink in thermal contact with an electronic component
IBM9 citations84
US6988533B2Jan 24, 2006
Method and apparatus for mounting a heat transfer apparatus upon an electronic component
IBM11 citations84
US7345881B2Mar 18, 2008
Non-influencing fastener for mounting a heat sink in contact with an electronic component
IBM15 citations83
US5929377AJul 27, 1999
Apparatus for preventing leakage of electromagnetic radiation from electronic enclosures
IBM11 citations68
US7071720B2Jul 4, 2006
Method and apparatus for managing aligning and coupling of a land grid array interposer for a field replacement unit
IBM2 citations62
US6792375B2Sep 14, 2004
Apparatus, system, and method of determining loading characteristics on an integrated circuit module
IBM5 citations62
US7765693B2Aug 3, 2010
Electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member
IBM5 citations61