Inventor
COBBLEY CHAD
US12 patents
⚠️ This page may combine multiple inventors who share the name “COBBLEY CHAD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
10 patentsUS6331221B1Dec 18, 2001
Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member
MICRON TECHNOLOGY INC192 citations98
US6584897B2Jul 1, 2003
Method and stencil for extruding material on a substrate
MICRON TECHNOLOGY INC21 citations92
US6501157B1Dec 31, 2002
Substrate for accepting wire bonded or flip-chip components
MICRON TECHNOLOGY INC22 citations92
US6089151AJul 18, 2000
Method and stencil for extruding material on a substrate
MICRON TECHNOLOGY INC31 citations92
US6064120AMay 16, 2000
Apparatus and method for face-to-face connection of a die face to a substrate with polymer electrodes
MICRON TECHNOLOGY INC39 citations92
US6689635B1Feb 10, 2004
Apparatus and method for face-to-face connection of a die to a substrate with polymer electrodes
MICRON TECHNOLOGY INC14 citations84
US7134390B2Nov 14, 2006
Method and stencil for extruding material on a substrate
MICRON TECHNOLOGY INC4 citations73
US6853058B2Feb 8, 2005
Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member
MICRON TECHNOLOGY INC6 citations73
US6427587B1Aug 6, 2002
Method and stencil for extruding material on a substrate
MICRON TECHNOLOGY INC8 citations73
US6269742B1Aug 7, 2001
Method and stencil for extruding material on a substrate
MICRON TECHNOLOGY INC8 citations73