Inventor
TAY WUU YEAN
SG29 patents
⚠️ This page may combine multiple inventors who share the name “TAY WUU YEAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
28 patentsUS6522018B1Feb 18, 2003
Ball grid array chip packages having improved testing and stacking characteristics
MICRON TECHNOLOGY INC244 citations98
US7754531B2Jul 13, 2010
Method for packaging microelectronic devices
MICRON TECHNOLOGY INC49 citations97
US6420789B1Jul 16, 2002
Ball grid array chip packages having improved testing and stacking characteristics
MICRON TECHNOLOGY INC72 citations97
US6693363B2Feb 17, 2004
Ball grid array chip packages having improved testing and stacking characteristics
MICRON TECHNOLOGY INC38 citations96
US6448664B1Sep 10, 2002
Ball grid array chip packages having improved testing and stacking characteristics
MICRON TECHNOLOGY INC37 citations96
US7915718B2Mar 29, 2011
Apparatus for flip-chip packaging providing testing capability
MICRON TECHNOLOGY INC29 citations92
US7071012B2Jul 4, 2006
Methods relating to the reconstruction of semiconductor wafers for wafer-level processing
MICRON TECHNOLOGY INC17 citations92
US6600335B2Jul 29, 2003
Method for ball grid array chip packages having improved testing and stacking characteristics
MICRON TECHNOLOGY INC23 citations92
US6787923B2Sep 7, 2004
Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks
MICRON TECHNOLOGY INC32 citations89
US7030640B2Apr 18, 2006
Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof
MICRON TECHNOLOGY INC15 citations84
US6847220B2Jan 25, 2005
Method for ball grid array chip packages having improved testing and stacking characteristics
MICRON TECHNOLOGY INC8 citations82
US6740984B2May 25, 2004
Ball grid array chip packages having improved testing and stacking characteristics
MICRON TECHNOLOGY INC12 citations82
US6740983B2May 25, 2004
Method for ball grind array chip packages having improved testing and stacking characteristics
MICRON TECHNOLOGY INC11 citations82
US6674175B2Jan 6, 2004
Ball grid array chip packages having improved testing and stacking characteristics
MICRON TECHNOLOGY INC11 citations82
US6522019B2Feb 18, 2003
Ball grid array chip packages having improved testing and stacking characteristics
MICRON TECHNOLOGY INC11 citations82
US7190074B2Mar 13, 2007
Reconstructed semiconductor wafers including alignment droplets contacting alignment vias
MICRON TECHNOLOGY INC5 citations73
US7116122B2Oct 3, 2006
Method for ball grid array chip packages having improved testing and stacking characteristics
MICRON TECHNOLOGY INC4 citations73
US7061124B2Jun 13, 2006
Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks
MICRON TECHNOLOGY INC10 citations72
US7018871B2Mar 28, 2006
Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods
MICRON TECHNOLOGY INC10 citations72
US6856155B2Feb 15, 2005
Methods and apparatus for testing and burn-in of semiconductor devices
MICRON TECHNOLOGY INC9 citations71
US7368391B2May 6, 2008
Methods for designing carrier substrates with raised terminals
MICRON TECHNOLOGY INC8 citations70
US11189548B2Nov 30, 2021
Pre-encapsulated lead frames for microelectronic device packages, and associated methods
MICRON TECHNOLOGY INC0 citations62
US8357566B2Jan 22, 2013
Pre-encapsulated lead frames for microelectronic device packages, and associated methods
MICRON TECHNOLOGY INC2 citations62
US7820459B2Oct 26, 2010
Methods relating to the reconstruction of semiconductor wafers for wafer level processing including forming of alignment protrusion and removal of alignment material
MICRON TECHNOLOGY INC1 citations62
US7425462B2Sep 16, 2008
Methods relating to the reconstruction of semiconductor wafers for wafer-level processing
MICRON TECHNOLOGY INC2 citations62
US7285971B2Oct 23, 2007
Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof
MICRON TECHNOLOGY INC5 citations62
US9721874B2Aug 1, 2017
Pre-encapsulated lead frames for microelectronic device packages, and associated methods
MICRON TECHNOLOGY INC0 citations51
US7573006B2Aug 11, 2009
Apparatus relating to the reconstruction of semiconductor wafers for wafer-level processing
MICRON TECHNOLOGY INC0 citations51