Inventor
GLENN THOMAS P
US136 patents
Patents
50 patentsUS6734419B1May 11, 2004
Method for forming an image sensor package with vision die in lens housing
AMKOR TECHNOLOGY INC209 citations99
US6686588B1Feb 3, 2004
Optical module with lens integral holder
AMKOR TECHNOLOGY INC267 citations99
US6672773B1Jan 6, 2004
Optical fiber having tapered end and optical connector with reciprocal opening
AMKOR TECHNOLOGY INC158 citations99
US6577013B1Jun 10, 2003
Chip size semiconductor packages with stacked dies
AMKOR TECHNOLOGY INC559 citations99
US6571466B1Jun 3, 2003
Flip chip image sensor package fabrication method
AMKOR TECHNOLOGY INC282 citations99
US6545345B1Apr 8, 2003
Mounting for a package containing a chip
AMKOR TECHNOLOGY INC199 citations99
US6530515B1Mar 11, 2003
Micromachine stacked flip chip package fabrication method
AMKOR TECHNOLOGY INC151 citations99
US6492699B1Dec 10, 2002
Image sensor package having sealed cavity over active area
AMKOR TECHNOLOGY INC148 citations99
US6483030B1Nov 19, 2002
Snap lid image sensor package
AMKOR TECHNOLOGY INC105 citations99
US6433277B1Aug 13, 2002
Plastic integrated circuit package and method and leadframe for making the package
AMKOR TECHNOLOGY INC83 citations99
US6424315B1Jul 23, 2002
Semiconductor chip having a radio-frequency identification transceiver
AMKOR TECHNOLOGY INC249 citations99
US6342406B1Jan 29, 2002
Flip chip on glass image sensor package fabrication method
AMKOR TECHNOLOGY INC174 citations99
US6291884B1Sep 18, 2001
Chip-size semiconductor packages
AMKOR TECHNOLOGY INC182 citations99
US6274927B1Aug 14, 2001
Plastic package for an optical integrated circuit device and method of making
AMKOR TECHNOLOGY INC228 citations99
US6268654B1Jul 31, 2001
Integrated circuit package having adhesive bead supporting planar lid above planar substrate
AMKOR TECHNOLOGY INC198 citations99
US6266197B1Jul 24, 2001
Molded window array for image sensor packages
AMKOR TECHNOLOGY INC337 citations99
US6228676B1May 8, 2001
Near chip size integrated circuit package
AMKOR TECHNOLOGY INC151 citations99
US6214644B1Apr 10, 2001
Flip-chip micromachine package fabrication method
AMKOR TECHNOLOGY INC158 citations99
US6150193ANov 21, 2000
RF shielded device
AMKOR TECHNOLOGY INC283 citations99
US6143981ANov 7, 2000
Plastic integrated circuit package and method and leadframe for making the package
AMKOR TECHNOLOGY INC476 citations99
US6143588ANov 7, 2000
Method of making an integrated circuit package employing a transparent encapsulant
AMKOR TECHNOLOGY INC291 citations99
US6117705ASep 12, 2000
Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate
AMKOR TECHNOLOGY INC202 citations99
US5981314ANov 9, 1999
Near chip size integrated circuit package
AMKOR TECHNOLOGY INC280 citations99
US5949655ASep 7, 1999
Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device
AMKOR TECHNOLOGY INC157 citations99
US6962829B2Nov 8, 2005
Method of making near chip size integrated circuit package
AMKOR TECHNOLOGY INC148 citations98
US6943429B1Sep 13, 2005
Wafer having alignment marks extending from a first to a second surface of the wafer
AMKOR TECHNOLOGY INC97 citations98
US6650019B2Nov 18, 2003
Method of making a semiconductor package including stacked semiconductor dies
AMKOR TECHNOLOGY INC123 citations98
US6627864B1Sep 30, 2003
Thin image sensor package
AMKOR TECHNOLOGY INC92 citations98
US6601293B1Aug 5, 2003
Method of making an electromagnetic interference shield device
AMKOR TECHNOLOGY INC82 citations98
US6528869B1Mar 4, 2003
Semiconductor package with molded substrate and recessed input/output terminals
AMKOR TECHNOLOGY INC131 citations98
US6528875B1Mar 4, 2003
Vacuum sealed package for semiconductor chip
AMKOR TECHNOLOGY INC75 citations98
US6526653B1Mar 4, 2003
Method of assembling a snap lid image sensor package
AMKOR TECHNOLOGY INC94 citations98
US6518659B1Feb 11, 2003
Stackable package having a cavity and a lid for an electronic device
AMKOR TECHNOLOGY INC117 citations98
US6503780B1Jan 7, 2003
Wafer scale image sensor package fabrication method
AMKOR TECHNOLOGY INC355 citations98
US6486545B1Nov 26, 2002
Pre-drilled ball grid array package
AMKOR TECHNOLOGY INC92 citations98
US6476476B1Nov 5, 2002
Integrated circuit package including pin and barrel interconnects
AMKOR TECHNOLOGY INC143 citations98
US6472598B1Oct 29, 2002
Electromagnetic interference shield device with conductive encapsulant and dam
AMKOR TECHNOLOGY INC92 citations98
US6472758B1Oct 29, 2002
Semiconductor package including stacked semiconductor dies and bond wires
AMKOR TECHNOLOGY INC193 citations98
US6455927B1Sep 24, 2002
Micromirror device package
AMKOR TECHNOLOGY INC126 citations98
US6424031B1Jul 23, 2002
Stackable package with heat sink
AMKOR TECHNOLOGY INC121 citations98
US6407381B1Jun 18, 2002
Wafer scale image sensor package
AMKOR TECHNOLOGY INC346 citations98
US6406934B1Jun 18, 2002
Wafer level production of chip size semiconductor packages
AMKOR TECHNOLOGY INC104 citations98
US6117193ASep 12, 2000
Optical sensor array mounting and alignment
AMKOR TECHNOLOGY INC130 citations98
US6092281AJul 25, 2000
Electromagnetic interference shield driver and method
AMKOR TECHNOLOGY INC95 citations98
US5962810AOct 5, 1999
Integrated circuit package employing a transparent encapsulant
AMKOR TECHNOLOGY INC115 citations98
US5867368AFeb 2, 1999
Mounting for a semiconductor integrated circuit device
AMKOR TECHNOLOGY INC130 citations98
US6564454B1May 20, 2003
Method of making and stacking a semiconductor package
AMKOR TECHNOLOGY INC76 citations97
US6448506B1Sep 10, 2002
Semiconductor package and circuit board for making the package
AMKOR TECHNOLOGY INC125 citations97
US6444499B1Sep 3, 2002
Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components
AMKOR TECHNOLOGY INC213 citations97
US6340846B1Jan 22, 2002
Making semiconductor packages with stacked dies and reinforced wire bonds
AMKOR TECHNOLOGY INC269 citations97
Showing the top 50 of 136 patents by PatentIndex Score.