Inventor
HOLLAWAY ROY DALE
US37 patents
⚠️ This page may combine multiple inventors who share the name “HOLLAWAY ROY DALE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
36 patentsUS6734419B1May 11, 2004
Method for forming an image sensor package with vision die in lens housing
AMKOR TECHNOLOGY INC209 citations99
US6686588B1Feb 3, 2004
Optical module with lens integral holder
AMKOR TECHNOLOGY INC267 citations99
US6571466B1Jun 3, 2003
Flip chip image sensor package fabrication method
AMKOR TECHNOLOGY INC282 citations99
US6530515B1Mar 11, 2003
Micromachine stacked flip chip package fabrication method
AMKOR TECHNOLOGY INC151 citations99
US6342406B1Jan 29, 2002
Flip chip on glass image sensor package fabrication method
AMKOR TECHNOLOGY INC174 citations99
US6943429B1Sep 13, 2005
Wafer having alignment marks extending from a first to a second surface of the wafer
AMKOR TECHNOLOGY INC97 citations98
US6627864B1Sep 30, 2003
Thin image sensor package
AMKOR TECHNOLOGY INC92 citations98
US6486545B1Nov 26, 2002
Pre-drilled ball grid array package
AMKOR TECHNOLOGY INC92 citations98
US6455927B1Sep 24, 2002
Micromirror device package
AMKOR TECHNOLOGY INC126 citations98
US7059040B1Jun 13, 2006
Optical module with lens integral holder fabrication method
AMKOR TECHNOLOGY INC46 citations96
US6849916B1Feb 1, 2005
Flip chip on glass sensor package
AMKOR TECHNOLOGY INC64 citations96
US6765801B1Jul 20, 2004
Optical track drain package
AMKOR TECHNOLOGY INC55 citations96
US6624921B1Sep 23, 2003
Micromirror device package fabrication method
AMKOR TECHNOLOGY INC72 citations96
US6580167B1Jun 17, 2003
Heat spreader with spring IC package
AMKOR TECHNOLOGY INC61 citations96
US6522015B1Feb 18, 2003
Micromachine stacked wirebonded package
AMKOR TECHNOLOGY INC70 citations96
US6399418B1Jun 4, 2002
Method for forming a reduced thickness packaged electronic device
AMKOR TECHNOLOGY INC65 citations96
US6399463B1Jun 4, 2002
Method of singulation using laser cutting
AMKOR TECHNOLOGY INC74 citations96
US6396043B1May 28, 2002
Thin image sensor package fabrication method
AMKOR TECHNOLOGY INC59 citations96
US6512219B1Jan 28, 2003
Fabrication method for integrally connected image sensor packages having a window support in contact with the window and active area
AMKOR TECHNOLOGY INC56 citations95
US7609461B1Oct 27, 2009
Optical module having cavity substrate
AMKOR TECHNOLOGY INC16 citations93
US6869861B1Mar 22, 2005
Back-side wafer singulation method
AMKOR TECHNOLOGY INC34 citations93
US6816523B1Nov 9, 2004
VCSEL package and fabrication method
AMKOR TECHNOLOGY INC42 citations93
US6686580B1Feb 3, 2004
Image sensor package with reflector
AMKOR TECHNOLOGY INC49 citations93
US6638789B1Oct 28, 2003
Micromachine stacked wirebonded package fabrication method
AMKOR TECHNOLOGY INC29 citations93
US6586824B1Jul 1, 2003
Reduced thickness packaged electronic device
AMKOR TECHNOLOGY INC56 citations93
US6562655B1May 13, 2003
Heat spreader with spring IC package fabrication method
AMKOR TECHNOLOGY INC45 citations93
US6420776B1Jul 16, 2002
Structure including electronic components singulated using laser cutting
AMKOR TECHNOLOGY INC39 citations93
US6515269B1Feb 4, 2003
Integrally connected image sensor packages having a window support in contact with a window and the active area
AMKOR TECHNOLOGY INC28 citations92
US6730536B1May 4, 2004
Pre-drilled image sensor package fabrication method
AMKOR TECHNOLOGY INC16 citations84
US6717126B1Apr 6, 2004
Method of fabricating and using an image sensor package with reflector
AMKOR TECHNOLOGY INC13 citations84
US6661080B1Dec 9, 2003
Structure for backside saw cavity protection
AMKOR TECHNOLOGY INC18 citations84
US6610167B1Aug 26, 2003
Method for fabricating a special-purpose die using a polymerizable tape
AMKOR TECHNOLOGY INC18 citations84
US6572944B1Jun 3, 2003
Structure for fabricating a special-purpose die using a polymerizable tape
AMKOR TECHNOLOGY INC13 citations84
US6670698B1Dec 30, 2003
Integrated circuit package mounting
AMKOR TECHNOLOGY INC11 citations74
US6580153B1Jun 17, 2003
Structure for protecting a micromachine with a cavity in a UV tape
AMKOR TECHNOLOGY INC10 citations74
US6548759B1Apr 15, 2003
Pre-drilled image sensor package
AMKOR TECHNOLOGY INC12 citations74