Inventor
NETSU TOSHITADA
JP6 patents
Patents
6 patentsUS6272020B1Aug 7, 2001
Structure for mounting a semiconductor device and a capacitor device on a substrate
HITACHI LTD82 citations95
US6528878B1Mar 4, 2003
Device for sealing and cooling multi-chip modules
HITACHI LTD72 citations94
US6890799B2May 10, 2005
Device for sealing and cooling multi-chip modules
HITACHI LTD30 citations91
US7518233B1Apr 14, 2009
Sealing structure for multi-chip module
HITACHI LTD16 citations83
US5151773ASep 29, 1992
Electronic circuit apparatus comprising a structure for sealing an electronic circuit
HITACHI LTD8 citations73
US5136360AAug 4, 1992
Electronic circuit device, method of connecting with solder and solder for connecting gold-plated terminals
HITACHI LTD14 citations73