Inventor
PRASHER RAVI
US28 patents
⚠️ This page may combine multiple inventors who share the name “PRASHER RAVI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
26 patentsUS6992382B2Jan 31, 2006
Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon
INTEL CORP122 citations99
US6934154B2Aug 23, 2005
Micro-channel heat exchangers and spreaders
INTEL CORP91 citations97
US6903929B2Jun 7, 2005
Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink
INTEL CORP111 citations97
US6696635B2Feb 24, 2004
Thermoelectrically cooling electronic devices
INTEL CORP50 citations96
US6381135B1Apr 30, 2002
Loop heat pipe for mobile computers
INTEL CORP109 citations96
US6661660B2Dec 9, 2003
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
INTEL CORP72 citations95
US6639799B2Oct 28, 2003
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
INTEL CORP67 citations95
US6469893B1Oct 22, 2002
Direct heatpipe attachment to die using center point loading
INTEL CORP53 citations95
US7435623B2Oct 14, 2008
Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon
INTEL CORP38 citations93
US6906919B2Jun 14, 2005
Two-phase pumped liquid loop for mobile computer cooling
INTEL CORP34 citations93
US7957137B2Jun 7, 2011
Method for cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel
INTEL CORP33 citations92
US7253523B2Aug 7, 2007
Reworkable thermal interface material
INTEL CORP28 citations92
US7115987B2Oct 3, 2006
Integrated stacked microchannel heat exchanger and heat spreader
INTEL CORP35 citations92
US6992381B2Jan 31, 2006
Using external radiators with electroosmotic pumps for cooling integrated circuits
INTEL CORP16 citations92
US6365821B1Apr 2, 2002
Thermoelectrically cooling electronic devices
INTEL CORP35 citations92
US6351387B1Feb 26, 2002
System and method of heat extraction from an integrated circuit die
INTEL CORP23 citations92
US6981849B2Jan 3, 2006
Electro-osmotic pumps and micro-channels
INTEL CORP20 citations91
US6625022B2Sep 23, 2003
Direct heatpipe attachment to die using center point loading
INTEL CORP40 citations91
US6504721B1Jan 7, 2003
Thermal cooling apparatus
INTEL CORP25 citations86
US7633752B2Dec 15, 2009
Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel
INTEL CORP14 citations84
US7243705B2Jul 17, 2007
Integrated circuit coolant microchannel with compliant cover
INTEL CORP10 citations84
US7365980B2Apr 29, 2008
Micropin heat exchanger
INTEL CORP6 citations74
US7309453B2Dec 18, 2007
Coolant capable of enhancing corrosion inhibition, system containing same, and method of manufacturing same
INTEL CORP5 citations58
US7576432B2Aug 18, 2009
Using external radiators with electroosmotic pumps for cooling integrated circuits
INTEL CORP1 citations52
US7498672B2Mar 3, 2009
Micropin heat exchanger
INTEL CORP0 citations52
US6751837B2Jun 22, 2004
Method of heat extraction from an integrated circuit die
INTEL CORP1 citations52