Inventor

IMANISHI MAKOTO

JP22 patents

⚠️ This page may combine multiple inventors who share the name “IMANISHI MAKOTO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IMANISHI MAKOTO

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Bump bonding method and bump bonding apparatus

Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor

Bump bonding apparatus and method

Linear actuating apparatus

Ultrasonic wire bonding apparatus and method

Working method for holding a work object by suction

Bump bonding apparatus and method

Bump bonding apparatus and method

Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer

Bump bonder with a discard bonding area

Device and method for forming bump

Method for mounting electronic components and apparatus and dispenser used in the method

Apparatus for mounting an electronic component

Bump bonding device and bump bonding method

Electronic component mounting apparatus and electronic component mounting method

Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer

Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore

Apparatus and method for forming bump

Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor

Bump levelling method and bump levelling apparatus

Bump bonding device and bump bonding method

PANASONIC CORP

Resin sealing structure for electronic component and resin sealing method for electronic component