Inventor

HIGASHI KAZUSHI

JP31 patents

⚠️ This page may combine multiple inventors who share the name “HIGASHI KAZUSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HIGASHI KAZUSHI

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Semiconductor device and manufacturing method thereof

Method of forming a ball bond using a bonding capillary

Method and apparatus for mounting component

Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor

Component mounting method and apparatus

Bump joining judging device and method, and semiconductor component production device and method

Component mounting apparatus including a polishing device

Method and apparatus for mounting component

Method and apparatus for mounting component

Semiconductor element having protruded bump electrodes

Device and method for forming bump

Semiconductor element having protruded bump electrodes

Bump joining method

Bump bonding device and bump bonding method

Method for assembling integral type electronic component and integral type electronic component

Apparatus and method for forming bump

Electronic part mounting apparatus and method

Bump-joining method

Optical information processing apparatus for use in Optical Computing, Optical image processing, and like

Bump bonding device and bump bonding method

PANASONIC CORP

Semiconductor light-emitting element, manufacturing method and mounting method of the same and light-emitting device

Packaged electronic element and method of producing electronic element package

Electronic device package manufacturing method and electronic device package

Component mounting tool, and method and apparatus for mounting component using this tool

Electronic part and method of producing the same

Semiconductor element and semiconductor element fabrication method

Semiconductor device

Formation of a through-electrode by inkjet deposition of resin pastes

HIGASHI KAZUSHI

Semiconductor light emitting device and semiconductor light emitting device mounted board

Electronic element package and method of manufacturing the same

Joining apparatus with UV cleaning