Inventor

KUAH TENG HOCK

SG27 patents

⚠️ This page may combine multiple inventors who share the name “KUAH TENG HOCK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KUAH TENG HOCK

ASM TECH SINGAPORE PTE LTD

Pellet feeding system for a molding machine

Mold and method for encapsulation of electronic device

Apparatus and method for reducing substrate warpage

Method for manufacturing wafer-level semiconductor packages

Mold for a semiconductor chip

Molding system for applying a uniform clamping pressure onto a substrate

Method and apparatus for molding a semiconductor device

Molding system for semiconductor packages

Mold for encapsulating a semiconductor chip

Method of detaching a film of material from a substrate

Removal of masking tape from lead frames

Compression molding of an electronic device

Molding apparatus

Method for encapsulating leadframe-mounted integrated circuits

Apparatus and method for processing a semiconductor device

Mold cleaning apparatus

Method of manufacturing an IC package

Semiconductor encapsulation system comprising a vacuum pump and a reservoir pump

ASMPT SINGAPORE PTE LTD

Apparatus for applying a sintering force via a compressible film

Encapsulation process for double-sided cooled packages

Flexible sinter tool for bonding semiconductor devices

Dual-sided molding for encapsulating electronic devices

Apparatus and method for removing a film from a surface

LI ZILAN

Apparatus for thin-film deposition

Feed-through apparatus for a chemical vapour deposition device

SU JIAN XIONG

Molding press and a platen for a molding press

KUAH TENG HOCK

Substrate carrier for molding electronic devices