Inventor
CHEN ROAWEN
US13 patents
⚠️ This page may combine multiple inventors who share the name “CHEN ROAWEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MARVELL INT LTD
5 patentsUS7704805B1Apr 27, 2010
Fuse structures, methods of making and using the same, and integrated circuits including the same
MARVELL INT LTD12 citations92
US7820493B1Oct 26, 2010
Methods of making and using fuse structures, and integrated circuits including the same
MARVELL INT LTD8 citations83
US6940107B1Sep 6, 2005
Fuse structures, methods of making and using the same, and integrated circuits including the same
MARVELL INT LTD8 citations73
US7589363B1Sep 15, 2009
Fuse structures, methods of making and using the same, and integrated circuits including the same
MARVELL INT LTD3 citations62
US7344924B1Mar 18, 2008
Fuse structures, methods of making and using the same, and integrated circuits including the same
MARVELL INT LTD2 citations62
MARVELL WORLD TRADE LTD
4 patentsUS9768144B2Sep 19, 2017
Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate
MARVELL WORLD TRADE LTD11 citations83
US8008137B2Aug 30, 2011
Method for fabricating 1T-DRAM on bulk silicon
MARVELL WORLD TRADE LTD19 citations83
US8935464B2Jan 13, 2015
Solid-state disk with wireless functionality
MARVELL WORLD TRADE LTD4 citations73
US9391045B2Jul 12, 2016
Recessed semiconductor substrates and associated techniques
MARVELL WORLD TRADE LTD0 citations51
WU ALBERT
2 patentsUS9257410B2Feb 9, 2016
Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate
WU ALBERT2 citations62
US9034730B2May 19, 2015
Recessed semiconductor substrates and associated techniques
WU ALBERT0 citations51