Inventor
HAYASHI KATSURA
JP33 patents
⚠️ This page may combine multiple inventors who share the name “HAYASHI KATSURA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KYOCERA CORP
22 patentsUS6359235B1Mar 19, 2002
Electrical device mounting wiring board and method of producing the same
KYOCERA CORP184 citations99
US6413620B1Jul 2, 2002
Ceramic wiring substrate and method of producing the same
KYOCERA CORP90 citations97
US6370013B1Apr 9, 2002
Electric element incorporating wiring board
KYOCERA CORP219 citations96
US6207259B1Mar 27, 2001
Wiring board
KYOCERA CORP174 citations96
US6143116ANov 7, 2000
Process for producing a multi-layer wiring board
KYOCERA CORP153 citations96
US6451441B1Sep 17, 2002
Film with metal foil
KYOCERA CORP45 citations94
US6663946B2Dec 16, 2003
Multi-layer wiring substrate
KYOCERA CORP69 citations93
US7271476B2Sep 18, 2007
Wiring substrate for mounting semiconductor components
KYOCERA CORP20 citations92
US5082809AJan 21, 1992
High-strength alumina sintered body and process for preparation thereof
KYOCERA CORP18 citations82
US9936583B2Apr 3, 2018
Wiring board and mounting structure using the same
KYOCERA CORP3 citations73
US9578738B2Feb 21, 2017
Wiring board and mounting: structure including the same
KYOCERA CORP2 citations73
US6936336B2Aug 30, 2005
Transfer sheet and production method of the same and wiring board and production method of the same
KYOCERA CORP10 citations73
US5360772ANov 1, 1994
Ceramic material reinforced by the incorporation of TiC, TiCN and TiN whiskers and processes for production thereof
KYOCERA CORP8 citations73
US8045829B2Oct 25, 2011
Optical waveguide member, optical wiring board, optical wiring module and method for manufacturing optical waveguide member and optical wiring board
KYOCERA CORP2 citations63
US8012561B2Sep 6, 2011
Fiber-reinforced resin and method for manufacturing the same
KYOCERA CORP2 citations62
US6866739B2Mar 15, 2005
Film with metal foil
KYOCERA CORP3 citations60
US10744575B2Aug 18, 2020
Tip and drill
KYOCERA CORP0 citations52
US8975537B2Mar 10, 2015
Circuit substrate, laminated board and laminated sheet
KYOCERA CORP0 citations52
US10792738B2Oct 6, 2020
Cutting tool and method of manufacturing machined product
KYOCERA CORP0 citations42
US9807874B2Oct 31, 2017
Wiring substrate, component embedded substrate, and package structure
KYOCERA CORP0 citations42
US9693451B2Jun 27, 2017
Wiring board, mounting structure using same, and method of manufacturing wiring board
KYOCERA CORP0 citations40
US9814136B2Nov 7, 2017
Wiring board, mounting structure equipped with the wiring board, and method for manufacturing wiring board
KYOCERA CORP0 citations33
HAYASHI KATSURA
5 patentsUS8446734B2May 21, 2013
Circuit board and mounting structure
HAYASHI KATSURA6 citations71
US8975529B2Mar 10, 2015
Interposer and electronic device using the same
HAYASHI KATSURA2 citations62
US8802996B2Aug 12, 2014
Wiring board and mounting structure thereof
HAYASHI KATSURA3 citations62
US8461462B2Jun 11, 2013
Circuit substrate, laminated board and laminated sheet
HAYASHI KATSURA4 citations62
US9485877B2Nov 1, 2016
Structure for circuit board used in electronic devices and method for manufacturing the same
HAYASHI KATSURA1 citations51
NIPPON CATALYTIC CHEM IND
2 patentsUS6384151B1May 7, 2002
Dicyclopentadiene-modified unsaturated polyester and process for producing the same as well as resin composition and molding material each containing unsaturated polyester
NIPPON CATALYTIC CHEM IND21 citations87
US5834547ANov 10, 1998
Molding compound composition, molding compound containing the same, and method for producing the molding compound
NIPPON CATALYTIC CHEM IND3 citations54