Inventor

BRUNSCHWILER THOMAS

CH40 patents

⚠️ This page may combine multiple inventors who share the name “BRUNSCHWILER THOMAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BRUNSCHWILER THOMAS

IBM

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

Flip-chip electronic device with carrier having heat dissipation elements free of solder mask

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

Disconnect assembly for active cooling of packaged electronics

High-performance compliant heat-exchanger comprising vapor chamber

Personalized copper block for selective solder removal

Semi-supervised learning with group constraints

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask

Flip-chip electronic device with carrier having heat dissipation elements free of solder mask

Printed circuit board with edge soldering for high-density packages and assemblies

Integrated device with defined heat flow

Electronic device having an electrode with enhanced injection properties

Disconnect assembly for active cooling of packaged electronics

Cooling device with nested chambers for computer hardware

Transferring heat through an optical layer of integrated circuitry

Particle-based, anisotropic composite materials for magnetic cores

Cooling system for an electronic component system cabinet

Printed circuit board with edge soldering for high-density packages and assemblies

Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste

BAROWSKI HARRY

Integrated circuit package connected to a data transmission medium

Thermal power plane for integrated circuits

Optimized semiconductor packaging in a three-dimensional stack

Heat sink integrated power delivery and distribution for integrated circuits

Integrated circuit package connected to an optical data transmission medium using a coolant

Optimized semiconductor packaging in a three-dimensional stack

Transferring heat through an optical layer of integrated circuitry

BRUNSCHWILER THOMAS

Optimizing heat transfer in 3-D chip-stacks

Integrated device with defined heat flow

Electronic device having an electrode with enhanced injection properties

Manufacturing a filling of a gap in semiconductor devices

BERNSTEIN KERRY

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

CONTRAVES SPACE AG

Optical waveguide coupler and method for producing same

GLOBALFOUNDRIES INC

Transferring heat through an optical layer of integrated circuitry