Inventor
KUMAGAYA YOSHIKAZU
JP16 patents
⚠️ This page may combine multiple inventors who share the name “KUMAGAYA YOSHIKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
5 patentsUS6291895B1Sep 18, 2001
Method of fabricating semiconductor having through hole
FUJITSU LTD40 citations91
US5953592ASep 14, 1999
Method of fabricating semiconductor having through hole
FUJITSU LTD18 citations91
US6457633B1Oct 1, 2002
Method of forming a BGA-type semiconductor device having reliable electrical connection for solder balls
FUJITSU LTD34 citations89
US6281571B1Aug 28, 2001
Semiconductor device having an external connection electrode extending through a through hole formed in a substrate
FUJITSU LTD13 citations72
US6869819B2Mar 22, 2005
Recognition method of a mark provided on a semiconductor device
FUJITSU LTD4 citations62
J DEVICES CORP
4 patentsUS9368474B2Jun 14, 2016
Manufacturing method for semiconductor device
J DEVICES CORP8 citations82
US10236231B2Mar 19, 2019
Semiconductor device
J DEVICES CORP5 citations71
US10134710B2Nov 20, 2018
Semiconductor package
J DEVICES CORP0 citations50
US9362200B2Jun 7, 2016
Heat sink in the aperture of substrate
J DEVICES CORP1 citations50
NISHIMURA TAKAO
4 patentsUS8076785B2Dec 13, 2011
Semiconductor device
NISHIMURA TAKAO6 citations73
US8810043B2Aug 19, 2014
Semiconductor device
NISHIMURA TAKAO4 citations72
US8659168B2Feb 25, 2014
Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring board
NISHIMURA TAKAO1 citations51
US8076769B2Dec 13, 2011
Semiconductor device and manufacturing method of semiconductor device
NISHIMURA TAKAO1 citations51