Inventor
PITNEY JOHN A
US16 patents
⚠️ This page may combine multiple inventors who share the name “PITNEY JOHN A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PITNEY JOHN A
5 patentsUS8330245B2Dec 11, 2012
Semiconductor wafers with reduced roll-off and bonded and unbonded SOI structures produced from same
PITNEY JOHN A20 citations91
US8440541B2May 14, 2013
Methods for reducing the width of the unbonded region in SOI structures
PITNEY JOHN A8 citations82
US8165706B2Apr 24, 2012
Methods for generating representations of flatness defects on wafers
PITNEY JOHN A16 citations82
US8186661B2May 29, 2012
Wafer holder for supporting a semiconductor wafer during a thermal treatment process
PITNEY JOHN A12 citations81
US8340801B2Dec 25, 2012
Systems for generating representations of flatness defects on wafers
PITNEY JOHN A6 citations71
GLOBALWAFERS CO LTD
4 patentsUS11282715B2Mar 22, 2022
Apparatus for stressing semiconductor substrates
GLOBALWAFERS CO LTD3 citations83
US11276583B2Mar 15, 2022
Apparatus for stressing semiconductor substrates
GLOBALWAFERS CO LTD2 citations72
US11764071B2Sep 19, 2023
Apparatus for stressing semiconductor substrates
GLOBALWAFERS CO LTD0 citations62
US11276582B2Mar 15, 2022
Apparatus for stressing semiconductor substrates
GLOBALWAFERS CO LTD0 citations62
SUNEDISON SEMICONDUCTOR LTD UEN201334164H
2 patentsSUNEDISON SEMICONDUCTOR LTD (UEN201334164H)
2 patentsUS9583363B2Feb 28, 2017
Processes and apparatus for preparing heterostructures with reduced strain by radial distension
SUNEDISON SEMICONDUCTOR LTD (UEN201334164H)5 citations83
US9583364B2Feb 28, 2017
Processes and apparatus for preparing heterostructures with reduced strain by radial compression
SUNEDISON SEMICONDUCTOR LTD (UEN201334164H)8 citations83