Inventor
LIN HUNG-WEN
TW28 patents
⚠️ This page may combine multiple inventors who share the name “LIN HUNG-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
COMCHIP TECH CO LTD
7 patentsUS10910268B2Feb 2, 2021
Method of manufacturing a chip package
COMCHIP TECH CO LTD0 citations60
US11302664B2Apr 12, 2022
Method of manufacturing die package structure
COMCHIP TECH CO LTD0 citations50
US11264355B2Mar 1, 2022
Method of manufacturing die package structure
COMCHIP TECH CO LTD0 citations50
US10950502B2Mar 16, 2021
Method of manufacturing a chip package
COMCHIP TECH CO LTD0 citations50
US10937760B2Mar 2, 2021
Method for manufacturing a chip package
COMCHIP TECH CO LTD0 citations50
US10777461B2Sep 15, 2020
Method for manufacturing a chip package
COMCHIP TECH CO LTD0 citations50
US10665509B2May 26, 2020
Method for manufacturing chip packages
COMCHIP TECH CO LTD0 citations39
HTC CORP
6 patentsUS9313389B2Apr 12, 2016
Camera assembly and electronic device
HTC CORP9 citations84
US9939858B2Apr 10, 2018
Electronic device
HTC CORP4 citations71
US9867312B2Jan 9, 2018
Electronic module and heat dissipation module
HTC CORP2 citations71
US9055206B1Jun 9, 2015
Electronic device
HTC CORP1 citations52
US9728352B2Aug 8, 2017
Switch structure and electronic device using the same
HTC CORP0 citations51
US9335801B2May 10, 2016
Frame and electronic device having the same
HTC CORP1 citations51
QUALCOMM INC
3 patentsUS11744045B2Aug 29, 2023
Electronic device comprising a thermally conductive connector comprising graphite
QUALCOMM INC7 citations82
US11733749B2Aug 22, 2023
Electronic device comprising thermally conductive connector
QUALCOMM INC0 citations56
US11637051B2Apr 25, 2023
Integrated device coupled to a step heat sink configured to provide shielding
QUALCOMM INC1 citations56