Inventor
CHANG JIE
US26 patents
⚠️ This page may combine multiple inventors who share the name “CHANG JIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMICONDUCTOR COMPONENTS IND LLC
7 patentsUS10566713B2Feb 18, 2020
Press-fit power module and related methods
SEMICONDUCTOR COMPONENTS IND LLC5 citations82
US12119576B2Oct 15, 2024
Press-fit power module and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US12354930B2Jul 8, 2025
Module with substrate recess for conductive-bonding component
SEMICONDUCTOR COMPONENTS IND LLC0 citations58
US11776871B2Oct 3, 2023
Module with substrate recess for conductive-bonding component
SEMICONDUCTOR COMPONENTS IND LLC0 citations58
US11127651B2Sep 21, 2021
High power module semiconductor package with multiple submodules
SEMICONDUCTOR COMPONENTS IND LLC0 citations56
US10553517B2Feb 4, 2020
High power module semiconductor package with multiple submodules
SEMICONDUCTOR COMPONENTS IND LLC0 citations51
US10804626B2Oct 13, 2020
Press-fit power module and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations50
BOEING CO
6 patentsUS6778414B2Aug 17, 2004
Distributed system and methodology of electrical power regulation, conditioning and distribution on an aircraft
BOEING CO96 citations93
US7211982B1May 1, 2007
Variable-structure diagnostics approach achieving optimized low-frequency data sampling for EMA motoring subsystem
BOEING CO27 citations90
US7081729B2Jul 25, 2006
Variable-structure diagnostics approach achieving optimized low-frequency data sampling for EMA motoring subsystem
BOEING CO21 citations90
US7034345B2Apr 25, 2006
High-power, integrated AC switch module with distributed array of hybrid devices
BOEING CO31 citations89
US6989592B2Jan 24, 2006
Integrated power module with reduced thermal impedance
BOEING CO30 citations87
US7449858B2Nov 11, 2008
Variable-Structure diagnostics approach achieving optimized low-frequency data sampling for EMA motoring subsystem
BOEING CO8 citations71