Inventor
HESS MICHAEL E
US36 patents
⚠️ This page may combine multiple inventors who share the name “HESS MICHAEL E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
35 patentsUS6578458B1Jun 17, 2003
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC106 citations99
US6553276B2Apr 22, 2003
Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
MICRON TECHNOLOGY INC48 citations96
US6427676B2Aug 6, 2002
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC24 citations96
US6401580B1Jun 11, 2002
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC20 citations96
US6363295B1Mar 26, 2002
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
MICRON TECHNOLOGY INC64 citations96
US6285203B1Sep 4, 2001
Test system having alignment member for aligning semiconductor components
MICRON TECHNOLOGY INC53 citations96
US6250192B1Jun 26, 2001
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC29 citations96
US6196096B1Mar 6, 2001
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC18 citations96
US6155247ADec 5, 2000
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC27 citations96
US6119675ASep 19, 2000
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC38 citations96
US6006739ADec 28, 1999
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC52 citations96
US5907492AMay 25, 1999
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
MICRON TECHNOLOGY INC81 citations96
US7155300B2Dec 26, 2006
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
MICRON TECHNOLOGY INC25 citations93
US7120513B1Oct 10, 2006
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs
MICRON TECHNOLOGY INC26 citations93
US6998334B2Feb 14, 2006
Semiconductor devices with permanent polymer stencil and method for manufacturing the same
MICRON TECHNOLOGY INC19 citations93
US6691696B2Feb 17, 2004
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC17 citations93
US6417685B1Jul 9, 2002
Test system having alignment member for aligning semiconductor components
MICRON TECHNOLOGY INC17 citations93
US6400174B2Jun 4, 2002
Test system having alignment member for aligning semiconductor components
MICRON TECHNOLOGY INC31 citations93
US6296171B1Oct 2, 2001
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
MICRON TECHNOLOGY INC22 citations93
US6045026AApr 4, 2000
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
MICRON TECHNOLOGY INC23 citations93
US6687990B2Feb 10, 2004
Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby
MICRON TECHNOLOGY INC13 citations84
US7561938B2Jul 14, 2009
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs
MICRON TECHNOLOGY INC7 citations74
US6932077B2Aug 23, 2005
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus
MICRON TECHNOLOGY INC5 citations74
US6897571B2May 24, 2005
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC2 citations74
US6631662B2Oct 14, 2003
Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC5 citations74
US6619532B2Sep 16, 2003
Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
MICRON TECHNOLOGY INC5 citations74
US6459105B2Oct 1, 2002
Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC4 citations74
US6427899B2Aug 6, 2002
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
MICRON TECHNOLOGY INC6 citations74
US6423616B2Jul 23, 2002
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC2 citations74
US6419143B2Jul 16, 2002
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
MICRON TECHNOLOGY INC8 citations74
US6255196B1Jul 3, 2001
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC5 citations74
US7387119B2Jun 17, 2008
Dicing saw with variable indexing capability
MICRON TECHNOLOGY INC0 citations63
US6851597B2Feb 8, 2005
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
MICRON TECHNOLOGY INC2 citations63
US6279563B1Aug 28, 2001
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC1 citations63
US7589010B2Sep 15, 2009
Semiconductor devices with permanent polymer stencil and method for manufacturing the same
MICRON TECHNOLOGY INC0 citations52